Search Results - heat+transfer

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2021-206 FLEXIBLE THERMAL INTERFACE BASED ON SELF-ASSEMBLED BORON ARSENIDE FOR THERMAL MANAGEMENT OF ELECTRONICS, OPTOELECTRONICS, PHOTONICS, WEARABLE COMFORTS

SUMMARY: Researchers in the Department of Mechanical and Aerospace Engineering at UCLA have developed a thermal interface for electronic devices that has highly desirable thermal conductivity and excellent elastic compliance. BACKGROUND: Electronic devices, such as smart phones and laptops, generate waste heat that must be dissipated to prevent...

Published: 7/19/2023 | Inventor(s):

Keywords(s): Electrical, Electronics & Semiconductors, Heat Transfer, Materials, Nanotechnology, Semiconductor Device, Semiconductors

Category(s): Chemical, Electrical, Materials, Materials > Nanotechnology, Materials > Semiconducting Materials, Optics & Photonics, Electrical > Electronics & Semiconductors

2020-388 Spectrally Selective Thermal Radiators for Cooling of Vertical or Horizontal Surfaces with Limited View of the Sky

SUMMARYUCLA researchers in the Department of Materials Science and Engineering have developed a passive radiative cooling design for building surfaces that have a limited view of the sky by using spectrally selective thermal radiating materials.BACKGROUNDPassive radiative cooling (PRC), a process where objects on Earth radiate heat into outer space,...

Published: 7/19/2023 | Inventor(s): Jyotirmoy Mandal, Pattabhi "Aaswath" Raman

Keywords(s): Chemical Manufacturing & Industrial/Bulk Chemicals, Heat Transfer, Materials, Mechanical Systems

Category(s): Mechanical > Mechanical Systems, Chemical > Industrial & Bulk Chemicals, Energy & Environment > Thermal

2018-191 Boron phosphide and its material systems for thermal management and thermal device applications

Boron Phosphide and Its Material Systems for Thermal Management and Thermal Device ApplicationsSUMMARYUCLA researchers in the Department of Mechanical and Aerospace engineering have developed a novel thermal management material, boron phosphide (BP), that is highly thermally conductive and inexpensive to manufacture, with many desirable properties to...

Published: 7/19/2023 | Inventor(s): Yongjie Hu, Joon Sang Kang

Keywords(s): Electronics & Semiconductors, Heat Transfer, Mechanical Systems

Category(s): Electrical > Electronics & Semiconductors, Mechanical > Mechanical Systems, Materials > Semiconducting Materials, Energy & Environment > Thermal

2018-468 Experimental Realization of High Thermal Conductivity Boron Arsenide for Thermal Management, Electronics, and Photonics Applications

Summary: UCLA researchers in the Department of Mechanical & Aerospace Engineering have developed a novel boron arsenide (BAs) material that has an ultra-high thermal conductivity of 1300 W/mK and low cost of synthesis and processing. Background: Thermal management in electronics is one of the industry’s major technical challenges. As the...

Published: 8/1/2023 | Inventor(s): Yongjie Hu, Joon Sang Kang

Keywords(s): Electronics & Semiconductors, Energy & Water, Heat Transfer, Mechanical Systems

Category(s): Electrical > Electronics & Semiconductors, Materials > Semiconducting Materials, Mechanical > Mechanical Systems, Electrical > Electronics & Semiconductors > Thermoelectrics, Energy & Environment

Electrocaloric Cooling With Electrostatic Actuation (UCLA Case No. 2017-646)

Summary: A collaboration between researchers in the UCLA Department of Materials Science and Engineering and SRI International has developed a novel solid-state cooling system that allows for efficient heat transfer for small, mobile devices. Background: With the development of modern technologies, the need for efficient heat transfer and cooling...

Published: 7/19/2023 | Inventor(s): Qibing Pei, David Huber, Roy Kornbluh, Rujun Ma, Ziyang Zhang

Keywords(s): Heat Transfer, Mechanical Systems

Category(s): Mechanical > Mechanical Systems, Electrical > Electronics & Semiconductors > Thermoelectrics

2012-426 Inorganic Aqueous Solution (IAS) for Phase-Change Heat Transfer Medium

SUMMARYUCLA researchers in the Department of Mechanical and Aerospace Engineering have invented a novel inorganic aqueous solution (IAS) that can be used with aluminum (Al) heat pipes for lightweight and space electronic cooling applications.BACKGROUNDHeat pipes, which transfer heat between a heat source and a heat sink, are an effective way to manage...

Published: 7/19/2023 | Inventor(s): Ivan Catton, Hui Shu Tao, Jacob Supowit, Ladan Amouzegar, Michael Stubblebine, Qi Yao, Sean Reilly

Keywords(s): Heat Transfer, Mechanical Systems

Category(s): Mechanical > Mechanical Systems, Energy & Environment > Thermal