UCLA Researchers & Innovators
Industry & Investors
News & Events
About
Concierge
Search Results - semiconductor
18
Results
Sort By:
Published Date
Updated Date
Title
ID
Descending
Ascending
Pulsed Dynamic Load Modulation Power Amplifier Circuit (Case No. 2006-330)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering developed a method for a power amplifier circuit with improved efficiency. Background: The wireless communication industry faces a demand for high data transfer rates with limited frequency resources. Existing methods of improving performance involve the use of power...
Published: 4/10/2024
|
Inventor(s):
Yuanxun Wang
,
Jinseong Jeong
Keywords(s):
Antennas/Wireless
,
attenuator
,
Doping (
Semiconductor
)
,
efficiency enhancement
,
Electronics &
Semiconductor
s
,
energy-efficient wireless communication
,
Microelectronics
Semiconductor
Device Fabrication
,
Organic
Semiconductor
,
power amplifier
,
Power Amplifier Circuit
,
pulsed load modulation
,
radiofrequency (RF) coil
,
radiofrequency signaling
,
RF signal
,
Semiconductor
,
semiconductor
chip foundries
,
Semiconductor
Device
,
Semiconductor
Device Fabrication
,
Semiconductor
Ohmic Contact
,
Semiconductor
Risk Assessment
,
Semiconductor
Sapphire
,
Semiconductor
s
,
variable load matching
,
Wireless
,
wireless capsule endoscopy
,
wireless communication
,
Wireless Sensor Network
,
zzsemiconducting materials
Category(s):
Electrical
,
Electrical > Signal Processing
,
Electrical > Wireless
,
Electrical > Electronics &
Semiconductor
s
A Chemical-Dedoping Strategy to Tailor Electron Density in Molecular-Intercalated Bulk Monolayer MOS2 (Case No. 2024-022)
Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel strategy to decouple the interlayer interactions in bulk MoS2 to produce a bulk material with desirable monolayer properties. Background: Molybdenum disulfide (MoS2) is a popular and well-studied 2D semiconducting layered material. A single layer, or...
Published: 3/13/2024
|
Inventor(s):
Xiangfeng Duan
,
Yu Huang
,
Boxuan Zhou
Keywords(s):
bulk material
,
bulk monolayer
,
chemical dedoping
,
direct bandgap
,
Doping (
Semiconductor
)
,
Electronics &
Semiconductor
s
,
exciton
,
indirect bandgap
,
intercalated materials
,
Microelectronics
Semiconductor
Device Fabrication
,
molybdenum disulfide (MOS2)
,
monolayer
,
Optoelectronic materials
,
Organic
Semiconductor
,
photoluminescence
,
photon absorption
,
Semiconductor
,
semiconductor
chip foundries
,
Semiconductor
Device
,
Semiconductor
Device Fabrication
,
Semiconductor
Ohmic Contact
,
Semiconductor
Risk Assessment
,
Semiconductor
Sapphire
,
Semiconductor
s
,
spin polarization
,
valley polarization
,
zzsemiconducting materials
Category(s):
Materials
,
Materials > Functional Materials
,
Materials > Semiconducting Materials
,
Electrical
,
Electrical > Electronics &
Semiconductor
s
A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)
Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In
semiconductor
packaging,...
Published: 2/16/2024
|
Inventor(s):
Subramanian Iyer
,
Krutikesh Sahoo
,
Haoxiang Ren
Keywords(s):
advanced packaging
,
advanced packaging constructs
,
dielet assembly
,
dielet bonding
,
Electronic Packaging
,
electronics packaging
,
Fabrication Technologies
,
face-to-face heterogeneous dielet bonding
,
heterogeneous integration
,
heterogenous electronic systems
,
high throughput
,
Instrumentation
,
Interposers
,
Microelectronics
Semiconductor
Device Fabrication
,
Organic
Semiconductor
,
package scaling
,
Semiconductor
,
semiconductor
chip foundries
,
Semiconductor
Device
,
Semiconductor
Device Fabrication
,
Semiconductor
s
,
thermal compression bonding
,
wafer-scale
,
wafer-scale computing
,
Waferscale Processors
Category(s):
Electrical
,
Electrical > Electronics &
Semiconductor
s
,
Electrical > Electronics &
Semiconductor
s > Waferscale Computing
,
Materials
,
Materials > Semiconducting Materials
,
Materials > Fabrication Technologies
,
Electrical > Instrumentation
Synaptic Circuits Made From Transistors and Memory Capacitors (UCLA Case No. 2023-092)
Summary: UCLA researchers from the Department of Mechanical and Aerospace Engineering have developed a novel circuit architecture that emulates neural synapses for concurrent parallel computing. Background: Almost all modern computer chips consist of computing and learning processes that are implemented sequentially. To improve computing power,...
Published: 12/19/2023
|
Inventor(s):
Yong Chen
,
Zixuan Rong
Keywords(s):
Application-Specific Integrated Circuit
,
Artifical Intelligence (Machine Learning, Data Mining)
,
artificial electromagnetic materials
,
Artificial Intelligence
,
artificial intelligence augmentation
,
Artificial Neural Network
,
Artificial Neural Network Artificial Neuron
,
artificial-intelligent materials
,
autonomous control
,
computational efficiency
,
edge computing
,
Electronics &
Semiconductor
s
,
Energy Efficiency
,
energy management
,
Integrated Circuit
,
Medical artificial intelligence (AI)
,
Neuromorphic circuits
,
parallel processing
,
parallel signal processing
,
processor design
,
Semiconductor
,
semiconductor
chip foundries
,
Semiconductor
Device
,
Semiconductor
s
,
synaptic resistor (synstor)
Category(s):
Electrical
,
Electrical > Electronics &
Semiconductor
s
,
Electrical > Signal Processing
,
Materials
,
Materials > Semiconducting Materials
,
Software & Algorithms
,
Software & Algorithms > Artificial Intelligence & Machine Learning
Copyright: Machine Learning-Assisted Design of High Power Laser Systems (Case No. 2024-067)
Summary: UCLA Researchers from the Department of Electrical and Computer Engineering have developed a novel software leveraging advanced machine learning methods to simulate and design high-power laser systems. Background: High-power laser systems are crucial to many established industries and in cutting edge research. These systems can be used in...
Published: 1/8/2024
|
Inventor(s):
Sergio Carbajo Garcia
,
Jack Hirschman
,
Randy Lemons
Keywords(s):
Artifical Intelligence (Machine Learning, Data Mining)
,
Artificial Intelligence
,
artificial intelligence augmentation
,
Artificial Neural Network
,
artificial-intelligent materials
,
efficient laser design
,
Electronics &
Semiconductor
s
,
Electro-Optics
,
high-powered laser systems
,
Laser
,
lasers
,
Lens (Optics)
,
linear optics
,
machine learning modeling
,
Medical artificial intelligence (AI)
,
non-linear optics
,
Optical Communication
,
Optical computing
,
optical implementation
,
Optics
,
parameter sweeping
,
Physics simulation
,
precision engraving
,
precision welding
,
reverse engineered optical system
,
Semiconductor
,
Semiconductor
Device
,
Semiconductor
Device Fabrication
,
start to end optics design
Category(s):
Software & Algorithms
,
Software & Algorithms > Artificial Intelligence & Machine Learning
,
Electrical
,
Electrical > Instrumentation
,
Optics & Photonics
,
Optics & Photonics > Lasers
Batteryless, Chipless Millimeterwave RFID Tags (UCLA Case No. 2023-220)
Intro Sentence: UCLA researchers in the Department of Computer Science have developed a chipless and batteryless RFID tag that operates at mmWave frequency and achieves millimeter resolution. Background: Radio frequency identification (RFID) tags have been used for a wide range of applications, such as baggage tracking and item localization in warehouses....
Published: 2/28/2024
|
Inventor(s):
Omid Abari
,
Mohammadreza Pakdeh
,
Mohammad Hossein Mazaheri Kalahrody
Keywords(s):
- Agriculture
,
Antenna (Radio) Flip Chip DisplayPort
,
Antennas/Wireless
,
Chipset
,
Electronics &
Semiconductor
s
,
Internet of Things (IoT)
,
Inventory
,
Inventory Management
,
Logistics
,
Millimeterwave network
,
real-time sensing/monitoring/tracking
,
RFID
,
RFID (Radio Frequency Identification)
,
Semiconductor
,
Semiconductor
s
,
Wireless
Category(s):
Electrical
,
Electrical > Wireless > Antennas
,
Electrical > Wireless
,
Electrical > Electronics &
Semiconductor
s
,
Electrical > Sensors
Headar: Sensing Head Gestures for Smartwatches With Wearable Radar (Case No. 2023-265)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed Headar, a wearable radar that can be implemented in smartwatches to detect head gestures. Background: Smartwatches have recently experienced rapid technological advancement and gained a large popularity due to their wide variety of applications features...
Published: 12/15/2023
|
Inventor(s):
Yang Zhang
,
Xiaoying Yang
,
Eiji Hayashi
Keywords(s):
Antennas/Wireless
,
Consumer Electronics
,
Electronics &
Semiconductor
s
,
head gesture
,
millimeter-wave
,
Radar
,
Radar / Antennae
,
Semiconductor
,
Semiconductor
Device
,
Semiconductor
s
,
Smart Antenna
,
Smart Material
,
smart sensing
,
Smartphone
,
Smartwatch
,
wearable
Category(s):
Software & Algorithms
,
Software & Algorithms > Ar/Vr
,
Electrical
,
Electrical > Wireless
,
Electrical > Sensors
,
Electrical > Wireless > Antennas
Dual-Stage On-Chip Optical-To-Microwave Low-Noise Synthesizer (Case No. 2022-059)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed the Dual-Stage On-Chip Optical-To-Microwave Low-Noise Synthesizer, which achieves exceptional phase-noise performance by combining optical and microwave components and is poised to improve telecommunications efficiencies. Background: The field of low-noise...
Published: 4/11/2024
|
Inventor(s):
Chee Wei Wong
,
Abhinav Kumar Vinod
Keywords(s):
Electronics &
Semiconductor
s
,
Microwave
,
Optics
,
Photonics
,
Semiconductor
,
Signal Processing
,
Signal-To-Noise Ratio
,
Wireless
Category(s):
Electrical
,
Electrical > Electronics &
Semiconductor
s
,
Electrical > Signal Processing
,
Electrical > Wireless
,
Optics & Photonics
2022-109 Methods and Apparatus for Intercoupled THz Radiating Arrays
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have designed a novel intercoupled oscillator array architecture for efficient THz generation. Background: Efficient THz generation in silicon technologies has been of great interest over the recent years, as it enables an integrated low-cost solution for sensing,...
Published: 1/10/2024
|
Inventor(s):
Aydin Babakhani
,
Seyedmohammadre Razavian
Keywords(s):
Active Antenna
,
Antenna (Radio)
,
Antenna (Radio) Flip Chip DisplayPort
,
Antennas/Wireless
,
Application-Specific Integrated Circuit
,
Communication & Networking
,
Continuous Wave
,
Continuous-Wave Radar
,
Diode
,
Doping (
Semiconductor
)
,
Elastomer Static Pressure Pulse Wave
,
Electronics &
Semiconductor
s
,
Frequency conversion
,
Integrated Circuit
,
Integrated Circuit Standing Wave
,
Integrated Circuit Via (Electronics)
,
Laser Diode
,
Light-Emitting Diode
,
Light-Emitting Diode Monochrome Inkjet Printing
,
Microelectronics
Semiconductor
Device Fabrication
,
Microstrip Antenna
,
Microwave
,
Microwave Base Transceiver Station
,
Microwave Microwave Video Scaler
,
Mixed-Signal Integrated Circuit
,
Monolithic Microwave Integrated Circuit
,
Network Analysis (Electrical Circuits)
,
Optoelectronics Waveguide (Electromagnetism)
,
Organic
Semiconductor
,
Patch Antenna
,
Patch Antenna Mobile Phone
,
Phase (Waves)
,
Photodiode
,
Photonic Integrated Circuit
,
PIN Diode
,
Printed Circuit Board
,
Radar / Antennae
,
Radio Frequency Sine Wave
,
Radiodensity
,
Semiconductor
,
Semiconductor
Device
,
Semiconductor
Device Fabrication
,
Semiconductor
Ohmic Contact
,
Semiconductor
Risk Assessment
,
Semiconductor
Sapphire
,
Semiconductor
s
,
Short Circuit
,
Smart Antenna
,
Standing Wave
,
Telecommunication
,
Three-Dimensional Integrated Circuit
,
Waveform
,
Waveguide
,
Waveguide (Electromagnetism)
,
Waveguide Light
,
Waveguide Waveguide (Electromagnetism)
,
Wavelength
,
zzsemiconducting materials
Category(s):
Electrical
,
Electrical > Electronics &
Semiconductor
s
,
Materials > Semiconducting Materials
,
Electrical > Wireless
2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs
Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...
Published: 7/19/2023
|
Inventor(s):
Subramanian Iyer
,
Haoxiang Ren
,
Saptadeep Pal
Keywords(s):
Amorphous Silicon
,
Artifical Intelligence (Machine Learning, Data Mining)
,
Artificial Intelligence
,
Artificial Neural Network
,
Bandwidth (Signal Processing)
,
Brain-Computer Interface
,
Brain-Computer Interface Body Mass Index
,
Chipset
,
Clock Signal
,
Computer Aided Design & Manufacturing
,
Computer Aided Learning
,
Computer Architecture
,
Computer Monitor
,
Computer Security
,
Computer Virus
,
Computer Vision
,
Computer-Aided Design
,
Computer-Aided Diagnosis
,
Continuum Mechanics Computer Graphics Collision Detection
,
Digital Signal Processing
,
Doping (
Semiconductor
)
,
Electrical
,
Electrical Engineering
,
Electrical Impedance
,
Electrical Load
,
Electrical Resistance And Conductance
,
Electrical Resistivity And Conductivity
,
Electronics &
Semiconductor
s
,
Graphics Processing Unit
,
Graphics Processing Unit Analog Computer
,
Human-Computer Interaction
,
Machine Learning
,
Machine Vision
,
Manufacturing
,
Microelectronics
Semiconductor
Device Fabrication
,
Microprocessor
,
Network Analysis (Electrical Circuits)
,
Network On A Chip
,
Organic
Semiconductor
,
Quantum Computer
,
Semiconductor
,
Semiconductor
Device
,
Semiconductor
Device Fabrication
,
Semiconductor
Ohmic Contact
,
Semiconductor
Risk Assessment
,
Semiconductor
Sapphire
,
Semiconductor
s
,
Signal Processing
,
Silicon
,
Silicon Dioxide
,
Silicon Working Electrode Perovskite (Structure)
,
Silicon-Germanium
,
Supercomputer
,
System On A Chip
,
Tablet Computer
Category(s):
Electrical
,
Electrical > Electronics &
Semiconductor
s
,
Electrical > Signal Processing
,
Materials > Semiconducting Materials
,
Electrical > Electronics &
Semiconductor
s > Circuits
,
Software & Algorithms > Artificial Intelligence & Machine Learning
1
2