Search Results - semiconductors

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Pulsed Dynamic Load Modulation Power Amplifier Circuit (Case No. 2006-330)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering developed a method for a power amplifier circuit with improved efficiency. Background: The wireless communication industry faces a demand for high data transfer rates with limited frequency resources. Existing methods of improving performance involve the use of power...

Published: 4/10/2024 | Inventor(s): Yuanxun Wang, Jinseong Jeong

Keywords(s): Antennas/Wireless, attenuator, Doping (Semiconductor), efficiency enhancement, Electronics & Semiconductors, energy-efficient wireless communication, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, power amplifier, Power Amplifier Circuit, pulsed load modulation, radiofrequency (RF) coil, radiofrequency signaling, RF signal, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, variable load matching, Wireless, wireless capsule endoscopy, wireless communication, Wireless Sensor Network, zzsemiconducting materials

Category(s): Electrical, Electrical > Signal Processing, Electrical > Wireless, Electrical > Electronics & Semiconductors

A Chemical-Dedoping Strategy to Tailor Electron Density in Molecular-Intercalated Bulk Monolayer MOS2 (Case No. 2024-022)

Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel strategy to decouple the interlayer interactions in bulk MoS2 to produce a bulk material with desirable monolayer properties. Background: Molybdenum disulfide (MoS2) is a popular and well-studied 2D semiconducting layered material. A single layer, or...

Published: 3/13/2024 | Inventor(s): Xiangfeng Duan, Yu Huang, Boxuan Zhou

Keywords(s): bulk material, bulk monolayer, chemical dedoping, direct bandgap, Doping (Semiconductor), Electronics & Semiconductors, exciton, indirect bandgap, intercalated materials, Microelectronics Semiconductor Device Fabrication, molybdenum disulfide (MOS2), monolayer, Optoelectronic materials, Organic Semiconductor, photoluminescence, photon absorption, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, spin polarization, valley polarization, zzsemiconducting materials

Category(s): Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors

A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)

Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...

Published: 2/16/2024 | Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren

Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation

Synaptic Circuits Made From Transistors and Memory Capacitors (UCLA Case No. 2023-092)

Summary: UCLA researchers from the Department of Mechanical and Aerospace Engineering have developed a novel circuit architecture that emulates neural synapses for concurrent parallel computing. Background: Almost all modern computer chips consist of computing and learning processes that are implemented sequentially. To improve computing power,...

Published: 12/19/2023 | Inventor(s): Yong Chen, Zixuan Rong

Keywords(s): Application-Specific Integrated Circuit, Artifical Intelligence (Machine Learning, Data Mining), artificial electromagnetic materials, Artificial Intelligence, artificial intelligence augmentation, Artificial Neural Network, Artificial Neural Network Artificial Neuron, artificial-intelligent materials, autonomous control, computational efficiency, edge computing, Electronics & Semiconductors, Energy Efficiency, energy management, Integrated Circuit, Medical artificial intelligence (AI), Neuromorphic circuits, parallel processing, parallel signal processing, processor design, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductors, synaptic resistor (synstor)

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials, Materials > Semiconducting Materials, Software & Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning

Batteryless, Chipless Millimeterwave RFID Tags (UCLA Case No. 2023-220)

Intro Sentence: UCLA researchers in the Department of Computer Science have developed a chipless and batteryless RFID tag that operates at mmWave frequency and achieves millimeter resolution. Background: Radio frequency identification (RFID) tags have been used for a wide range of applications, such as baggage tracking and item localization in warehouses....

Published: 2/28/2024 | Inventor(s): Omid Abari, Mohammadreza Pakdeh, Mohammad Hossein Mazaheri Kalahrody

Keywords(s): - Agriculture, Antenna (Radio) Flip Chip DisplayPort, Antennas/Wireless, Chipset, Electronics & Semiconductors, Internet of Things (IoT), Inventory, Inventory Management, Logistics, Millimeterwave network, real-time sensing/monitoring/tracking, RFID, RFID (Radio Frequency Identification), Semiconductor, Semiconductors, Wireless

Category(s): Electrical, Electrical > Wireless > Antennas, Electrical > Wireless, Electrical > Electronics & Semiconductors, Electrical > Sensors

Headar: Sensing Head Gestures for Smartwatches With Wearable Radar (Case No. 2023-265)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed Headar, a wearable radar that can be implemented in smartwatches to detect head gestures. Background: Smartwatches have recently experienced rapid technological advancement and gained a large popularity due to their wide variety of applications features...

Published: 12/15/2023 | Inventor(s): Yang Zhang, Xiaoying Yang, Eiji Hayashi

Keywords(s): Antennas/Wireless, Consumer Electronics, Electronics & Semiconductors, head gesture, millimeter-wave, Radar, Radar / Antennae, Semiconductor, Semiconductor Device, Semiconductors, Smart Antenna, Smart Material, smart sensing, Smartphone, Smartwatch, wearable

Category(s): Software & Algorithms, Software & Algorithms > Ar/Vr, Electrical, Electrical > Wireless, Electrical > Sensors, Electrical > Wireless > Antennas

2022-109 Methods and Apparatus for Intercoupled THz Radiating Arrays

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have designed a novel intercoupled oscillator array architecture for efficient THz generation. Background: Efficient THz generation in silicon technologies has been of great interest over the recent years, as it enables an integrated low-cost solution for sensing,...

Published: 1/10/2024 | Inventor(s): Aydin Babakhani, Seyedmohammadre Razavian

Keywords(s): Active Antenna, Antenna (Radio), Antenna (Radio) Flip Chip DisplayPort, Antennas/Wireless, Application-Specific Integrated Circuit, Communication & Networking, Continuous Wave, Continuous-Wave Radar, Diode, Doping (Semiconductor), Elastomer Static Pressure Pulse Wave, Electronics & Semiconductors, Frequency conversion, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), Laser Diode, Light-Emitting Diode, Light-Emitting Diode Monochrome Inkjet Printing, Microelectronics Semiconductor Device Fabrication, Microstrip Antenna, Microwave, Microwave Base Transceiver Station, Microwave Microwave Video Scaler, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, Network Analysis (Electrical Circuits), Optoelectronics Waveguide (Electromagnetism), Organic Semiconductor, Patch Antenna, Patch Antenna Mobile Phone, Phase (Waves), Photodiode, Photonic Integrated Circuit, PIN Diode, Printed Circuit Board, Radar / Antennae, Radio Frequency Sine Wave, Radiodensity, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, Smart Antenna, Standing Wave, Telecommunication, Three-Dimensional Integrated Circuit, Waveform, Waveguide, Waveguide (Electromagnetism), Waveguide Light, Waveguide Waveguide (Electromagnetism), Wavelength, zzsemiconducting materials

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials > Semiconducting Materials, Electrical > Wireless

2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs

Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer, Haoxiang Ren, Saptadeep Pal

Keywords(s): Amorphous Silicon, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, Artificial Neural Network, Bandwidth (Signal Processing), Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Clock Signal, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Machine Learning, Machine Vision, Manufacturing, Microelectronics Semiconductor Device Fabrication, Microprocessor, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Supercomputer, System On A Chip, Tablet Computer

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Circuits, Software & Algorithms > Artificial Intelligence & Machine Learning

Silicon Interconnect Fabric (Si-IF) Technologies - Subramanian Iyer

Background: Over the past two decades, silicon chips have decreased in size by 1000x, while packages on circuit boards have only shrunk by 4x. This will eventually limit scaling of integrated circuits and subsequent processor performance. A solution is the invention of platforms for packageless integration of heterogeneous dies, such as silicon interconnect...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer

Keywords(s): Amorphous Silicon, Antenna (Radio) Flip Chip DisplayPort, Application-Specific Integrated Circuit, Bandwidth (Signal Processing), Bandwidth (Signal Processing) RF Transmitters, Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Brain Stimulation, Electrical Breakdown, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Load Equation Of State, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Enzyme Substrate (Biology), Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Image Processing, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), Lab-On-A-Chip, Microelectronics Semiconductor Device Fabrication, Microprocessor, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Photonic Integrated Circuit, Printed Circuit Board, Process Optimization, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Substrate (Chemistry), Supercomputer, System On A Chip, Tablet Computer, Three-Dimensional Integrated Circuit, Transcutaneous Electrical Nerve Stimulation, zzsemiconducting materials

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Semiconducting Materials, Medical Devices, Medical Devices > Coatings

2022-209 Modulating Heterointerface Energetics for Operationally Stable Perovskite Solar Cells

Summary: UCLA researchers in the Department of Material Science and Engineering have developed an innovative and low-cost process that increases the stability of perovskite solar cells. Background: Perovskite Solar Cells (PSCs) are a rather new but growing technology for the efficient conversion of solar light to electricity. Most conventional silicon-based...

Published: 8/4/2023 | Inventor(s): Yang Yang, Shaun Tan, Tianyi Huang

Keywords(s): Cell Surface Receptor, Compressed Air Energy Storage, Concentrated Solar Power, Concentrated Solar Power Chemical Engineering, Doping (Semiconductor), Electronics & Semiconductors, Energy & Water, Energy Balance (Biology), Energy Density, Energy Density Boiling Point, Energy Density Silicide, Energy Density Strong Interaction, Energy Efficiency, Energy Generation & Storage, Energy Generation, Transmission, or Storage, Energy Harvesting, Energy Harvesting Evaporation, Energy Management System, Energy Recycling, Energy Security , Exosome (Vesicle) Surface Enhanced Raman Spectroscopy, Fermi Energy, Forster Resonance Energy Transfer, Free Surface, Methods Of Detecting Extrasolar Planets, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, Organic Solar Cell, Perovskite Lead(II) Iodide, Polymer Solar Cell, Power Transmission, Renewable Energy, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Silicon Working Electrode Perovskite (Structure), Solar Cell, Solar Cell Metamaterial, Solar Cell Molecular Electronics, Solar Energy, Specific Surface Area, Stroke Geriatrics Energy Accounting Local Area Network, Surface Charge, Surface Conductivity, Surface Enhanced Raman Spectroscopy, Surface Micromachining, Surface Modification, Surface Plasmon Polaritons, Surface Plasmon Resonance, Surface Tension, Thermal Energy Storage, Thin Film Solar Cell, Vertical-Cavity Surface-Emitting Laser, Vertical-External-Cavity Surface-Emitting-Laser, zzenergy storage, zzsemiconducting materials

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Semiconducting Materials, Energy & Environment > Energy Generation > Solar

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