2021-040 A Wireless Recording System-On-Chip for Distributed Neural Interface Systems with Inductive Power Delivery and UWB Data Transmission

SUMMARY

UCLA researchers in the Department of the Electrical and Computer Engineering have developed a wireless system-on-chip device that allows for real-time patient neural activity monitoring and stimulation.

BACKGROUND

The power and data demands of neurological implants have grown with the increased implementation of Brain Machine Interface (BMI) systems in treating patients who suffer from neurological injuries Advancements in neural activity monitoring biosensors allow for the collection and transmission of data from distributed neural networks and provide real-time diagnostics of patients to medical practitioners. Additionally, the global market for patient monitoring devices as of 2018 was 20.3 billion and expected to reach 25.9 billion by 2023. Therefore, there is a need for a neurological implant capable of both patient monitoring and neuro stimulus treatment to diagnose patient recovery and response.

INNOVATION

UCLA researchers in the Department of the Electrical and Computer Engineering have developed a wireless, low-power, miniaturized (mm form factor) low-cost wireless device for real-time patient neural activity monitoring and delivery of neuronal stimulus. The fully integrated system-on-chip (SoC) device is powered by an inductive wireless link and can wireless record and send data using different frequencies. The device is fabricated using a 180 nm CMOS process technology, allowing it to be easily scaled and while reducing the device footprint for patient comfort. The SoC device with its wireless operation is a promising solution for low-power and miniaturized neural recording systems. 

POTENTIAL APPLICATIONS

  • Point-of-care diagnostics
  • Neurological injury care
  • Patient response monitoring

ADVANTAGES

  • Real-time monitoring
  • Better Spatiotemporal resolution
  • Higher data-rate
  • Low-power
  • Low footprint
  • Ease of implantation
  • 180 nm CMOS process technology compatible

RELATED MATERIALS

STATUS OF DEVELOPMENT

First successful proof of concept apparatus demonstrated.

Patent Information:
For More Information:
Greg Markiewicz
Business Development Officer
greg.markiewicz@tdg.ucla.edu
Inventors:
Hamed Rahmani
Aydin Babakhani