High Performance Thin Films from Solution Processible Two-Dimensional Nanoplates (Case No. 2015-175)

Summary:

UCLA researchers in the departments of Chemistry and Materials Science have recently developed a novel material for use in flexible, printed electronics.

Background:

Producing cheap, lightweight, and flexible electronics requires depositing electronic materials onto flexible, plastic substrates. Traditional methods of material deposition require high temperatures and/or pressures in order to produce high quality materials that are sufficiently conductive. The current material of choice for use in conductive thin films is indium tin oxide (ITO); however the cost and quality of the material make it prohibitive for cheap, flexible electronics. An ideal conductive thin film would maintain its excellent electronic transport characteristics while granting additional benefits, such as flexibility and the ability to be printed directly onto plastic substrates.

Innovation:

UCLA researchers in the departments of Chemistry and Materials Science have recently developed a novel material based on semiconducting nanoplates for use in flexible, printed electronics. Researchers started by carefully growing two-dimensional nanoplates and then suspending them in solution to make colloidal ink. The nanoplate ink can be directly printed onto plastic substrates, while the colloidal nature of the ink reduces clumping and allows for uniform deposition. The resulting thin film is highly conductive due to the high surface area connectivity that results from the stacked nanoplates. The nanostructure additionally allows for the greater mechanical compliance needed in flexible applications. The nanoplate ink allows for highly conductive thin films to be directly printed onto flexible plastic substrates.

Patent:

10,319,589

Applications:

  • Printed electronics
  • Flexible electronics
  • Conformal, conductive coatings

Advantages:

  • Higher conductivity than similar conductive colloidal inks
  • Inexpensive deposition method when compared to traditional methods
  • Greater mechanical compliance for flexible applications

State of Development:

A working prototype has been developed and tested.

Patent Information:
For More Information:
Ed Beres
Business Development Officer
edward.beres@tdg.ucla.edu
Inventors:
Xiangfeng Duan
Yu Huang