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2021-041 A Tandem-Structured Cooling Device Driven by Electrostatic Force

SUMMARYResearchers in the UCLA Department of Materials Science and Engineering have developed an electrocaloric (EC) cooling device for compact applications, such as wearable electronics and implantables.BACKGROUNDSolid-state cooling technologies are an ecofriendly alternative to vapor compression refrigeration technology for thermal management. Cooling...

Published: 7/19/2023 | Inventor(s): Qibing Pei, Yuan Meng

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Category(s): Electrical > Electronics & Semiconductors > Thermoelectrics, Energy & Environment > Thermal