SUMMARY
UCLA researchers in the Department of Electrical and Computer Engineering have developed an efficient and low-cost method to integrate inorganic light emitting diodes into rubber-like substrates that are transparent, flexible and biocompatible.
BACKGROUND
There is a growing demand for modular and flexible light emitting displays for applications in electronics and medical devices. Inorganic light emitting diodes (LEDs) are attractive owing to the enhanced brightness and long-term stability associated with these devices when compared to organic-based LEDs. Unfortunately, manufacture of flexible inorganic LEDs is limited by the challenges associated with circuitry transfer and size disparity between the device components. Therefore, a critical needs exists for the development of bendable inorganic LEDs in order to meet the demand for such technology in electronics components.
INNOVATION
UCLA researchers in the Department of Electrical and Computer Engineering have overcome the manufacturing limitations of existing inorganic LED architectures by embedding the components into a flexible polymer substrate. Both millimeter and micrometer-sized components are connected by the polymer layer, overcoming any size disparity issues. Facile integration of optical components such as lenses and waveguides, as well as polymer transparency, allow for full light emission. The polymer used, poly dimethyl siloxane (PDMS), is biocompatible, allowing medical applications like optogenetic stimulation. Importantly, the method represents a much lower cost and high-end manufacturability which could result in mass implementation of flexible, inorganic LED technology.
POTENTIAL APPLICATIONS
- Virtual reality
- Augmented reality
- Medical wearables
- Implants for optogenetic stimulation
- Light induced therapeutics
ADVANTAGES
- A flexible, transparent, biocompatible elastomeric substrate
- Micrometer and millimeter sized components embedded into polymer substrate
- Integrated with optical elements including lenses and waveguides
- Size between 5 to 100 microns
- > 200 pixel per inch density
- 100% laser lift off yield achieved
- Undamaged even for < 5mm bending of the package
PATENT STATUS
United States Of America Published Patent Application 20190287927 09/19/2019