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2003-126 Glass-Modified Stress Waves for Adhesion Measurement of Ultra Thin Films and Nanoelectronics Device Fabrication

Professor Vijay Gupta - http://gupta.seas.ucla.edu/ SUMAMRY UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a fast, reliable, atomic-level sensitive adhesion metrology tool for measuring the tensile strength of multilayer interfaces and epoxy-bonded joints such as those appearing in the semiconductor (ICs,...

Published: 7/19/2023 | Inventor(s): Vijay Gupta, Vassili Kireev

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Category(s): Electrical > Electronics & Semiconductors, Materials, Materials > Nanotechnology, Materials > Semiconducting Materials, Materials > Composite Materials, Materials > Fabrication Technologies

2016-102 COMPOSITE FOAM & 2011-177 MATERIAL FOR MITIGATING IMPACT FORCES WITH COLLISION DURATIONS IN NANOSECONDS TO MILLISECONDS RANGE

Composite FoamSUMMARYUCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel composite foam for impact applications.BACKGROUNDPolymeric materials used for impact resistance often strain-harden, causing the skeleton struts and beams to stiffen up, the pores to collapse, and large stress buildup. This results...

Published: 7/19/2023 | Inventor(s): Vijay Gupta, Brian Ramirez, Utkarsh Misra

Keywords(s): Chemical Manufacturing & Industrial/Bulk Chemicals, Construction Materials, Electronics & Semiconductors

Category(s): Electrical > Electronics & Semiconductors, Materials > Fabrication Technologies, Chemical > Industrial & Bulk Chemicals