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A Reactor Design to Enable Efficient Microbial Electrolysis System With High Hydrogen Production Rate (Case No. 2025-298)

Summary: UCLA researchers in the Department of Materials Science and Engineering have developed a novel reactor design for bias-free microbial electrolysis system operation, enabling efficient high-rate hydrogen production. Background: As demand for clean hydrogen production rises, microbial electrolysis systems (MES) continue to show promise for...

Published: 5/14/2026 | Inventor(s): Yu Huang, Xiangfeng Duan, Leyuan Zhang

Keywords(s): Anaerobic digestion enhancement, bias-free microbial electrolysis system, Biorefineries/chemical plants, clean electricity generation, clean hydrogen production, Decentralized, off-grid, Electroactive Polymers, Electrocatalyst, Food/agricultural waste processing, Half-Reaction Electrolysis Of Water Oxygen Evolution, high-rate hydrogen production, Hydrogen fueling stations, microbial electrolysis, Microbial electrolysis system (MES), microbial electrolysis systems (MES), municipal/industrial wastewater treatment plants, Post-treatment for energy recovery, Semiconductor processing plant wastewater

Category(s): Energy & Environment, Energy & Environment > Energy Efficiency, Energy & Environment > Energy Generation, Energy & Environment > Energy Storage, Energy & Environment > Energy Transmission, Energy & Environment > Energy Storage > Fuel Cells, Energy & Environment > Water Monitoring & Treatment, Materials, Materials > Functional Materials, Materials > Nanotechnology, Materials > Water Treatment

Electroless Plating Solution for Forming Metal Films on Inert Substrates (Case No. 2026-211)

Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel electroless plating solution that facilitates metal deposition on inert polymers without conventional pre-treatment. Background: Metal thin films deposited on inert polymer substrates are critical components in wearable electronics, sensors, and flexible...

Published: 4/16/2026 | Inventor(s): Matthew Nava, Oliver Garcia

Keywords(s):

Category(s): Materials, Materials > Composite Materials, Materials > Fabrication Technologies, Materials > Functional Materials, Materials > Metals, Materials > Nanotechnology

Carbon-Negative Desalination With High-Value Materials Recovery (Case No. 2024-008)

Summary: Researchers led by Dr. Eric Hoek have developed a carbon-negative method to desalinate brine and seawater and extract valuable materials from the source solution. Background: Increased global temperatures and extreme droughts are driving water shortages throughout the world. To address this, water recycling and desalination efforts have...

Published: 3/26/2026 | Inventor(s): Eric Hoek, Sungtaek Ju, Yoram Cohen, David Jassby

Keywords(s): brine, brine concentrate, carbon negative, carbon neutral, carbon sequestration, Desalination Wastewater, Energy & Water, freshwater generation, global carbon utilization, Half-Reaction Electrolysis Of Water Oxygen Evolution, Membrane bioreactor, membrane fouling, membrane scaling, Membranes, mineral harvesting, nanofiltration, renewable fuel, reverse osmosis (RO), Seawater, treatment efficacy, Wastewater treatment, Water Injection (Oil Production), Water Purification, Nanofiltration, Ultrafiltration, water recovery, Water treatment

Category(s): Chemical, Chemical > Chemical Processing & Manufacturing, Energy & Environment, Energy & Environment > Energy Generation, Energy & Environment > Water Monitoring & Treatment, Energy & Environment > Carbon Capture, Energy & Environment > Energy Efficiency, Materials, Materials > Nanotechnology, Materials > Water Treatment, Materials > Membranes

Non-Destructive Probes for Known Good Die and Assembly Testing (Case No. 2026-073)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a liquid-metal-based, nondestructive probing platform for high-density semiconductor die and assembly testing. Background: As semiconductor devices become smaller and more complex, manufacturers face growing challenges in testing chips before they are...

Published: 3/2/2026 | Inventor(s): Subramanian Iyer, Samuel Wang

Keywords(s): biocompatible, Chipset, dielet assembly, Electrical, Electrical Engineering, Electronic Packaging, electronics packaging, high throughput testing, Liquid metal particles, liquid metals, low-cost fabrication, MEMS, micro-electromechanical systems (MEMS), Microelectronics Semiconductor Device Fabrication, scalable fabrication, Semiconductor, Semiconductor Device Fabrication, Semiconductors, soft electrical circuits, wafer-scale

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Fabrication Technologies, Materials > Semiconducting Materials, Mechanical > Manufacturing, Mechanical > Micro-Electromechanical Systems (Mems)

Superconducting Diodes for Qubit Readout (Case No. 2026-079)

Summary: UCLA researchers led by Professor Pri Narang have developed a fully superconducting, on-chip readout architecture that improves signal fidelity and limits backpropagation in quantum processors Background: Superconducting quantum processors can perform complex calculations orders of magnitude quicker than classical computers. Current superconducting...

Published: 3/3/2026 | Inventor(s): Prineha Narang, Arpit Arora, Nicolas Dirnegger

Keywords(s):

Category(s): Electrical, Electrical > Quantum Computing, Electrical > Signal Processing, Electrical > Sensors, Electrical > Instrumentation, Electrical > Computing Hardware, Materials, Materials > Fabrication Technologies, Materials > Functional Materials, Materials > Semiconducting Materials

Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...

Published: 3/5/2026 | Inventor(s): Tiwei Wei

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)

Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors

Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...

Published: 3/5/2026 | Inventor(s): Tiwei Wei, Ye Yang

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials

Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking

A Selenium Buffer Method for Making Van Der Waals Contact on CDTE Wafers With High Surface Roughness (Case No. 2025-173)

Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel method for implementation of Van der Waals contact on commercial CdTe wafers for improved photovoltaic and solar panel production. Background: Cadmium Telluride (CdTe) is a common absorber used for thin-film optoelectronics and photovoltaics, including...

Published: 1/28/2026 | Inventor(s): Yu Huang, Xiangfeng Duan, Bangyao Hu

Keywords(s):

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Chemical, Chemical > Chemical Processing & Manufacturing, Chemical > Instrumentation & Analysis, Electrical > Sensors, Energy & Environment, Energy & Environment > Energy Efficiency, Energy & Environment > Energy Generation, Materials, Materials > Semiconducting Materials

Θ-Phase Tantalum Nitride for Thermal Management and Electronics Applications (Case No. 2026-180)

Summary: Researchers in UCLA’s Department of Mechanical and Aerospace Engineering have developed a novel transition metal compound that demonstrates what is thought to be the highest thermal conductivity reported among metallic materials. The material is synthesized as a single, defect-free crystal, enabling unprecedented efficiency in heat transport....

Published: 1/20/2026 | Inventor(s): Yongjie Hu

Keywords(s): advanced thermal control materials, Composite Material, Electronics & Semiconductors, energy-efficient, heat control, heat controlling devices, heat dissipation, Heat Transfer, high conductivity, material science, Materials, Metals, nanocrystalline metals, Power Electronics, temperature control, thermal control, thermal control materials, thermal management, thermal management systems, thermal metamaterials

Category(s): Chemical, Chemical > Chemical Processing & Manufacturing, Chemical > Synthesis, Electrical, Electrical > Electronics & Semiconductors > Thermoelectrics, Energy & Environment > Thermal, Materials, Materials > Metals, Mechanical > Heat Transfer

Immobilized Peptides for Rare Earth Element Separation (Case No. 2026-031)

Summary: UCLA researchers in the Department of Materials Science and Engineering have developed a bead-based chromatography platform that employs immobilized peptides for improved rare earth element separation and recovery. Background: Rare earth elements (REEs) are critical inputs for renewable energy technologies, electric vehicles, advanced electronics,...

Published: 1/5/2026 | Inventor(s): Aaron Moment, Zihang Su

Keywords(s): bulk material, clean material production, Composite Material, Composite Materials, Construction Materials, Functional Materials, material characterization, material science, Materials, meta materials, Nanomaterials, Peptide, Peptide Base, peptides, rare earth element separation, Raw materials supplier, safe materials, Smart Material, sustainable rare earth recovery

Category(s): Materials, Materials > Functional Materials, Materials > Nanotechnology, Energy & Environment, Materials > Metals

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