SUMMARY
Researchers at the UCLA Department of Electrical & Computer Engineering have developed a novel network on interconnect fabric (NoIF) to support global communication, power conversion and management, synchronization, and to facilitate testing within the silicon interconnect fabric (Si-IF).
BACKGROUND
Modern systems contain a variety of heterogeneous circuit blocks, and require ultra large-scale integration to accommodate different applications. Ideally, silicon interconnect fabric (Si-IF) is a compatible platform to satisfy the needs of modern systems through supporting integration of bare (unpackaged) dies using thermal compression bonding on a Si wafer substrate. Fine pitch horizontal and vertical interconnects are feasible within the Si-IF using standard Si processing techniques. However, to enable the Si-IF as a practical platform for ultra large-scale heterogeneous integration, system-level issues, similar to a large system on a chip, must be addressed.
INNOVATION
Researchers at UCLA have developed a novel network on interconnect fabric (NoIF), which enables integration of ultra large-scale heterogeneous systems within the technologically mature Si-IF platforms. NoIF is based on utility dies that serve as intelligent nodes within the network.
POTENTIAL APPLICATIONS
NoIF offers a wafer-level framework to enable multiple services, including:
- Global and semi-global communication
- Power delivery
- Conversion
- Management, synchronization, testing
ADVANTAGES
- Heterogeneous, ultra large-scale integration
RELATED MATERIALS
STATE OF DEVELOPMENT
Conceptual stage.
PATENT STATUS
United States of America Published Patent Application 20200403293 12/24/2020