Search Results - boris+vaisband

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2018-220 Network On Interconnect Fabric

SUMMARYResearchers at the UCLA Department of Electrical & Computer Engineering have developed a novel network on interconnect fabric (NoIF) to support global communication, power conversion and management, synchronization, and to facilitate testing within the silicon interconnect fabric (Si-IF).BACKGROUNDModern systems contain a variety of heterogeneous...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer, Boris Vaisband, Adeel Bajwa, Arpan Dasgupta, Arsalan Alam

Keywords(s): Electronics & Semiconductors, Microelectronics Semiconductor Device Fabrication, Optics, Semiconductor Device Fabrication

Category(s): Electrical > Electronics & Semiconductors, Materials > Fabrication Technologies

2018-337 Power Distribution within Silicon Interconnect Fabric

SUMMARYUCLA researchers in the Department of Electrical and Computer Engineering have developed a novel method of powering systems on silicon interconnect fabrics for integration of packageless processors.BACKGROUNDOver the past two decades, silicon chips have decreased in size by 1000x, while packages on circuit boards have only shrunk by 4x. This...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer, Adeel Bajwa, Boris Vaisband

Keywords(s): Electronics & Semiconductors, Nanosensor

Category(s): Electrical > Electronics & Semiconductors, Materials > Fabrication Technologies