Search Results - electrical+%3e+electronics+%26+semiconductors

168 Results

Sort By:

Pulsed Dynamic Load Modulation Power Amplifier Circuit (Case No. 2006-330)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering developed a method for a power amplifier circuit with improved efficiency. Background: The wireless communication industry faces a demand for high data transfer rates with limited frequency resources. Existing methods of improving performance involve the use of power...

Published: 4/10/2024 | Inventor(s): Yuanxun Wang, Jinseong Jeong

Keywords(s): Antennas/Wireless, attenuator, Doping (Semiconductor), efficiency enhancement, Electronics & Semiconductors, energy-efficient wireless communication, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, power amplifier, Power Amplifier Circuit, pulsed load modulation, radiofrequency (RF) coil, radiofrequency signaling, RF signal, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, variable load matching, Wireless, wireless capsule endoscopy, wireless communication, Wireless Sensor Network, zzsemiconducting materials

Category(s): Electrical, Electrical > Signal Processing, Electrical > Wireless, Electrical > Electronics & Semiconductors

1-Micron Frequency Comb OCT System (Case No. 2023-036)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a new optical coherence tomography system for clinical imaging applications. Background: Optical coherence tomography (OCT) is a non-invasive imaging technique that is used in many clinical settings. OCT is used in ophthalmology to visualize layers...

Published: 3/20/2024 | Inventor(s): Chee Wei Wong, Tristan Melton, James McMillan

Keywords(s):

Category(s): Electrical, Electrical > Imaging, Electrical > Electronics & Semiconductors, Life Science Research Tools, Life Science Research Tools > Microscopy And Imaging, Life Science Research Tools > Animal Imaging, Mechanical, Mechanical > Instrumentation

A Chemical-Dedoping Strategy to Tailor Electron Density in Molecular-Intercalated Bulk Monolayer MOS2 (Case No. 2024-022)

Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel strategy to decouple the interlayer interactions in bulk MoS2 to produce a bulk material with desirable monolayer properties. Background: Molybdenum disulfide (MoS2) is a popular and well-studied 2D semiconducting layered material. A single layer, or...

Published: 3/13/2024 | Inventor(s): Xiangfeng Duan, Yu Huang, Boxuan Zhou

Keywords(s): bulk material, bulk monolayer, chemical dedoping, direct bandgap, Doping (Semiconductor), Electronics & Semiconductors, exciton, indirect bandgap, intercalated materials, Microelectronics Semiconductor Device Fabrication, molybdenum disulfide (MOS2), monolayer, Optoelectronic materials, Organic Semiconductor, photoluminescence, photon absorption, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, spin polarization, valley polarization, zzsemiconducting materials

Category(s): Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors

A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)

Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...

Published: 2/16/2024 | Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren

Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation

Wireless Network (Or Cloud) Based Management of Multiplexed EV Charging Infrastructure (Case No. 2012-224)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a networked infrastructure for electric vehicle (EV) charging. Background: As demand for electrical vehicles increases, there is a pressing need for advanced charging solutions that can cater to the growing number of vehicles. Modern charging infrastructures...

Published: 2/14/2024 | Inventor(s): Rajit Gadh, Ching Yen Chung, Li Qiu

Keywords(s): charge collection, charge sharing, charge-transfer, clean energy consumption, Cloud Computing, Communication & Networking, device architectures, Electric Vehicle, electric vehicle charging, grid efficiency, grid energy, Rechargeable Battery, supercharger, tesla, vehicle charging

Category(s): Software & Algorithms, Electrical, Electrical > Electronics & Semiconductors, Software & Algorithms > Communication & Networking, Energy & Environment, Energy & Environment > Energy Efficiency, Energy & Environment > Energy Generation, Energy & Environment > Energy Storage, Energy & Environment > Energy Storage > Batteries, Energy & Environment > Energy Transmission

High Performance Thin Films from Solution Processible Two-Dimensional Nanoplates (Case No. 2015-175)

Summary: UCLA researchers in the departments of Chemistry and Materials Science have recently developed a novel material for use in flexible, printed electronics. Background: Producing cheap, lightweight, and flexible electronics requires depositing electronic materials onto flexible, plastic substrates. Traditional methods of material deposition...

Published: 1/19/2024 | Inventor(s): Xiangfeng Duan, Yu Huang

Keywords(s):

Category(s): Electrical > Electronics & Semiconductors

Synaptic Circuits Made From Transistors and Memory Capacitors (UCLA Case No. 2023-092)

Summary: UCLA researchers from the Department of Mechanical and Aerospace Engineering have developed a novel circuit architecture that emulates neural synapses for concurrent parallel computing. Background: Almost all modern computer chips consist of computing and learning processes that are implemented sequentially. To improve computing power,...

Published: 12/19/2023 | Inventor(s): Yong Chen, Zixuan Rong

Keywords(s): Application-Specific Integrated Circuit, Artifical Intelligence (Machine Learning, Data Mining), artificial electromagnetic materials, Artificial Intelligence, artificial intelligence augmentation, Artificial Neural Network, Artificial Neural Network Artificial Neuron, artificial-intelligent materials, autonomous control, computational efficiency, edge computing, Electronics & Semiconductors, Energy Efficiency, energy management, Integrated Circuit, Medical artificial intelligence (AI), Neuromorphic circuits, parallel processing, parallel signal processing, processor design, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductors, synaptic resistor (synstor)

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials, Materials > Semiconducting Materials, Software & Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning

Batteryless, Chipless Millimeterwave RFID Tags (UCLA Case No. 2023-220)

Intro Sentence: UCLA researchers in the Department of Computer Science have developed a chipless and batteryless RFID tag that operates at mmWave frequency and achieves millimeter resolution. Background: Radio frequency identification (RFID) tags have been used for a wide range of applications, such as baggage tracking and item localization in warehouses....

Published: 2/28/2024 | Inventor(s): Omid Abari, Mohammadreza Pakdeh, Mohammad Hossein Mazaheri Kalahrody

Keywords(s): - Agriculture, Antenna (Radio) Flip Chip DisplayPort, Antennas/Wireless, Chipset, Electronics & Semiconductors, Internet of Things (IoT), Inventory, Inventory Management, Logistics, Millimeterwave network, real-time sensing/monitoring/tracking, RFID, RFID (Radio Frequency Identification), Semiconductor, Semiconductors, Wireless

Category(s): Electrical, Electrical > Wireless > Antennas, Electrical > Wireless, Electrical > Electronics & Semiconductors, Electrical > Sensors

Dual-Stage On-Chip Optical-To-Microwave Low-Noise Synthesizer (Case No. 2022-059)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed the Dual-Stage On-Chip Optical-To-Microwave Low-Noise Synthesizer, which achieves exceptional phase-noise performance by combining optical and microwave components and is poised to improve telecommunications efficiencies. Background: The field of low-noise...

Published: 4/11/2024 | Inventor(s): Chee Wei Wong, Abhinav Kumar Vinod

Keywords(s): Electronics & Semiconductors, Microwave, Optics, Photonics, Semiconductor, Signal Processing, Signal-To-Noise Ratio, Wireless

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Electrical > Wireless, Optics & Photonics

AI Copilot: Enhancing Brain-Machine Interface Performance (UCLA Case No. 2023-110)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed an artificial intelligence (AI) assistance framework for brain-machine interface (BMI) applications designed to enhance users' ability to complete tasks efficiently and swiftly. Background: Paralysis affects over 5 million individuals in the U.S.,...

Published: 1/12/2024 | Inventor(s): Jonathan Kao, Brandon McMahan, Sangjoon Lee, Johannes Lee

Keywords(s): actor-critic networks, AI copilot, Artificial Intelligence, Artificial Neural Network, Brain-Computer Interface, brain-machine interface (BMI), deep reinforcement learning, integrated robotics, neural effort, neural information, neural signals, non-invasive BMI, Orthopedics and Prosthetics (O & P), Prosthesis, Prosthetics, Robotics

Category(s): Medical Devices, Medical Devices > Prosthetics, Mechanical, Mechanical > Robotics, Software & Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning, Electrical > Electronics & Semiconductors

1 2 3 4 5 6 7 8 9 10 ...