Search Results - materials+%3e+fabrication+technologies

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A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)

Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...

Published: 2/16/2024 | Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren

Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation

Ion-Solvent-Polymer Interactions for Preparing Polymer Networks and Composites of Tunable Structures and Properties (UCLA Case No. 2023-147)

Summary: Researchers in UCLA's Department of Materials Science and Engineering have developed a solution-based synthesis platform capable of generating micro and nanostructured gels, polymers, and composites with simultaneously improved safety, mechanical and ionic conductivity/transport properties. Background: Pore structure engineering holds...

Published: 11/20/2023 | Inventor(s): Ximin He

Keywords(s):

Category(s): Chemical, Chemical > Polymers, Chemical > Synthesis, Energy & Environment, Energy & Environment > Energy Storage, Materials, Materials > Fabrication Technologies, Materials > Functional Materials, Materials > Composite Materials

2023-056 A Method to Make High Strength, High Ductility, and High Electrical Conductivity Metals

Summary: UCLA researchers in the Department of Materials Science and Engineering have developed ultra-strong metal nanocomposites with high ductility, thermal stability, and electrical conductivity. Background: In many different applications, including those in the aerospace, defense, electronics, energy, and transportation sectors, nanocrystalline...

Published: 12/12/2023 | Inventor(s): Yinmin Wang, Zan Li

Keywords(s): graphene, high-strength, metal nanocomposites, Metals, Nanocrystal, nanocrystalline metals, nanodispersion, nanograined metals, Nanomaterials, Nanoparticle, Nanoparticles, nanostructured materials, Nanotechnology, reduced graphene oxide, strength-ductility, strength-electrical conductivity, strength-thermal stability

Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Metals, Materials > Fabrication Technologies

2003-126 Glass-Modified Stress Waves for Adhesion Measurement of Ultra Thin Films and Nanoelectronics Device Fabrication

Professor Vijay Gupta - http://gupta.seas.ucla.edu/ SUMAMRY UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a fast, reliable, atomic-level sensitive adhesion metrology tool for measuring the tensile strength of multilayer interfaces and epoxy-bonded joints such as those appearing in the semiconductor (ICs,...

Published: 7/19/2023 | Inventor(s): Vijay Gupta, Vassili Kireev

Keywords(s):

Category(s): Electrical > Electronics & Semiconductors, Materials, Materials > Nanotechnology, Materials > Semiconducting Materials, Materials > Composite Materials, Materials > Fabrication Technologies

2020-456 Passive 3D Shape via Polarization-Aware Neural Networks

SUMMARYUCLA researchers in the Department of Electrical Engineering and Computer Science have developed an algorithm to take image data and generate accurate 3D shape representations using a deep neural network framework. The method uses data from polarization imaging to generate 3D models that are less sensitive to noise and that are five times more...

Published: 7/19/2023 | Inventor(s): Achuta Kadambi, Alex Gilbert, Franklin Wang, Yunhao Ba

Keywords(s):

Category(s): Software & Algorithms > Artificial Intelligence & Machine Learning, Materials > Fabrication Technologies, Mechanical > Robotics

2020-445 Liquid Scintillator Containing High-Z Nanoparticles

SUMMARYUCLA researchers in the Department of Materials Science and Engineering have developed an organic scintillator for identification of gamma radiation. This scintillator has high loading of high-Z nanoparticles without sacrificing optical transparency for better gamma ray detection. BACKGROUNDInorganic scintillators are widely used for the detection...

Published: 7/19/2023 | Inventor(s): Qibing Pei, Hongxiang Zhao

Keywords(s):

Category(s): Materials > Composite Materials, Materials > Nanotechnology, Chemical > Polymers, Materials > Fabrication Technologies

2020-770 Apparatus and Method for Changing the Functionality of an Integrated Circuit Using Charge Trap Transistors

SUMMARYUCLA researchers in the Department of Electrical and Computer Engineering have developed a method to overcome manufacturing defects in semiconducting wafers through post-production calibration of integrated circuits by threshold voltage tuning using charge trap transistors. BACKGROUNDComplementary metal-oxide-semiconductors (CMOS) are utilized...

Published: 9/26/2023 | Inventor(s): Subramanian Iyer

Keywords(s):

Category(s): Electrical > Electronics & Semiconductors, Mechanical > Manufacturing, Chemical, Materials > Fabrication Technologies

2019-879 An Electronically-Controlled Digital Ferrofluidic Architecture for Scalable and Addressable Bioanalytical Operations

SUMMARYUCLA researchers in the Department of Electrical and Computer Engineering have developed a contactless digital ferrofluidic approach for small-volume droplet generation, manipulation and transport. BACKGROUND Automated microfluidic technologies can perform autonomous, accurate, and consistent fluidic operations. Current automated systems have...

Published: 7/19/2023 | Inventor(s): Sam Emaminejad, Dino Di Carlo

Keywords(s):

Category(s): Materials > Nanotechnology, Life Science Research Tools > Microfluidics And Mems, Materials > Fabrication Technologies, Platforms > Diagnostic Platform Technologies, Platforms > Drug Delivery > Nanoparticles, Chemical > Industrial & Bulk Chemicals

Zinc Nanocomposites and Stents for Functional Applications

UC Case No. 2018-355 SUMMARY: UCLA researchers in the Department of Mechanical Engineering have developed a method to manufacture zinc-based metal matrix nanocomposites (MMNCs) for functional applications, such as stents. BACKGROUND: The materials presently used for medical stents all have certain drawbacks. For example, iron-based stents have...

Published: 7/19/2023 | Inventor(s): Xiaochun Li

Keywords(s):

Category(s): Medical Devices > Surgical Tools, Materials > Fabrication Technologies, Therapeutics > Cardiovascular

2019-317 Scalable Manufacturing of Copper Nanocomposites with Tunable Properties

SUMMARYUCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a cost-effective method to produce copper-based nanocomposites with excellent mechanical, electrical and thermal properties.BACKGROUNDHigh performance copper-based materials are needed for a wide range of applications, spanning industries as diverse as aerospace,...

Published: 7/19/2023 | Inventor(s): Xiaochun Li, Chezheng Cao, Gongcheng Yao, Shuaihang Pan

Keywords(s):

Category(s): Electrical > Electronics & Semiconductors, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Energy & Environment

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