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Selective Deposition Of Diamond In Thermal Vias

SummaryUCLA researchers in the Department of Materials Science & Engineering have developed a new method of diamond deposition in integrated circuit vias for thermal dissipation.BackgroundModern integrated circuits (IC) are typically fabricated by growing layers of semiconductors on a substrate. This growing method, epitaxial fabrication, has enabled...

Published: 7/19/2023 | Inventor(s): Mark Goorsky, Jeff Mckay, Karl Hobart, Tatyana Feygelson, Eugene Imhoff, Travis Anderson, Joshua Caldwell, Andrew Koehler, Bradford Pate, Marko Tadjer, Randijer Sandhu, Vincent Gambin, Gregory Lewis, Ioulia Smorchkova

Keywords(s): Electronics & Semiconductors

Category(s): Electrical > Electronics & Semiconductors, Materials > Semiconducting Materials