Search Results - materials+%3e+semiconducting+materials

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A Library of Layered Hybrid Superlattices and Artificial Quantum Solids (Case No. 2024-098)

Summary: UCLA researchers have developed a novel approach for the generation of hybrid superlattices with tunable properties. Background: Heterostructures are composed of two or more semiconductor crystals with interfaces across which chemical makeup changes, and superlattices are simply composed of nanoscale layers that allow quantum confinement...

Published: 3/27/2024 | Inventor(s): Xiangfeng Duan, Yu Huang, Jingyuan Zhou

Keywords(s):

Category(s): Electrical, Electrical > Quantum Computing, Materials, Materials > Functional Materials, Materials > Semiconducting Materials

Prineha Narang Quantum Computing Portfolio

Lab Interview: Quantum Trailblazers: NarangLab’s Pursuit Technology Portfolio: Contracted Quantum Eigensolver for Excited States (Quantum Algorithm) (Case No. 2023-180) Prineha Narang and her team have developed a new quantum algorithm for calculating the excited states using a contracted quantum eigensolver (ES-CQE). ES-CQE uses a contraction...

Published: 3/27/2024 | Inventor(s): Prineha Narang

Keywords(s):

Category(s): Materials, Materials > Semiconducting Materials, Materials > Functional Materials, Electrical, Electrical > Quantum Computing

A Chemical-Dedoping Strategy to Tailor Electron Density in Molecular-Intercalated Bulk Monolayer MOS2 (Case No. 2024-022)

Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel strategy to decouple the interlayer interactions in bulk MoS2 to produce a bulk material with desirable monolayer properties. Background: Molybdenum disulfide (MoS2) is a popular and well-studied 2D semiconducting layered material. A single layer, or...

Published: 3/13/2024 | Inventor(s): Xiangfeng Duan, Yu Huang, Boxuan Zhou

Keywords(s): bulk material, bulk monolayer, chemical dedoping, direct bandgap, Doping (Semiconductor), Electronics & Semiconductors, exciton, indirect bandgap, intercalated materials, Microelectronics Semiconductor Device Fabrication, molybdenum disulfide (MOS2), monolayer, Optoelectronic materials, Organic Semiconductor, photoluminescence, photon absorption, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, spin polarization, valley polarization, zzsemiconducting materials

Category(s): Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors

A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)

Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...

Published: 2/16/2024 | Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren

Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation

Quantum Cross-Resonator Spectrometer (Case No. 2023-181)

Summary: UCLA researchers in the Division of Physical Sciences and Engineering have developed a novel method of characterizing the complex dielectric function of a material. Background: The complex dielectric function is a measure of a material’s response to static or alternating electromagnetic fields and describes the microscopic behavior...

Published: 3/25/2024 | Inventor(s): Prineha Narang, Ioannis Petrides, Jonathan Curtis, Amir Yacoby, Marie Wesson

Keywords(s): Quantum Computer, quantum processing, quantum processor

Category(s): Electrical, Materials, Materials > Semiconducting Materials, Electrical > Quantum Computing

Synaptic Circuits Made From Transistors and Memory Capacitors (UCLA Case No. 2023-092)

Summary: UCLA researchers from the Department of Mechanical and Aerospace Engineering have developed a novel circuit architecture that emulates neural synapses for concurrent parallel computing. Background: Almost all modern computer chips consist of computing and learning processes that are implemented sequentially. To improve computing power,...

Published: 12/19/2023 | Inventor(s): Yong Chen, Zixuan Rong

Keywords(s): Application-Specific Integrated Circuit, Artifical Intelligence (Machine Learning, Data Mining), artificial electromagnetic materials, Artificial Intelligence, artificial intelligence augmentation, Artificial Neural Network, Artificial Neural Network Artificial Neuron, artificial-intelligent materials, autonomous control, computational efficiency, edge computing, Electronics & Semiconductors, Energy Efficiency, energy management, Integrated Circuit, Medical artificial intelligence (AI), Neuromorphic circuits, parallel processing, parallel signal processing, processor design, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductors, synaptic resistor (synstor)

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials, Materials > Semiconducting Materials, Software & Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning

2022-258 Deep Learning-Enabled Detection and Classification of Bacterial Colonies Using a Thin Film Transistor (TFT) Image Sensor

Summary: UCLA Researchers in the Department of Electrical and Computer Engineering have developed a thin-film transistor-based image sensor that can quantify and identify bacterial colony forming units (CFUs) with high accuracy using a deep-learning algorithm. Background: Bacterial infections are a leading cause of death every year in both developed...

Published: 7/19/2023 | Inventor(s): Aydogan Ozcan, Yuzhu Li, Tairan Liu

Keywords(s): Antibacterial, Artificial Neural Network, Bacteria, Holography, Machine Learning, Magnetic Resonance Imaging Carotid Artery Stenosis, Thin-Film Transistor, Transistor

Category(s): Software & Algorithms, Life Science Research Tools, Life Science Research Tools > Screening Libraries, Materials, Materials > Nanotechnology, Materials > Semiconducting Materials, Life Science Research Tools > Cell Counting And Imaging

2010-241 Single-Mask Double-Patterning Lithography

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a shift-trim double-patterning lithography (ST-DPL) technique to improve the manufacturing of microprocessors and allow for densely-featured patterns. Background: Photolithography is a common method used for the production of various electrical materials...

Published: 8/1/2023 | Inventor(s): Puneet Gupta, Rani Ghaida

Keywords(s):

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Memory

2022-109 Methods and Apparatus for Intercoupled THz Radiating Arrays

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have designed a novel intercoupled oscillator array architecture for efficient THz generation. Background: Efficient THz generation in silicon technologies has been of great interest over the recent years, as it enables an integrated low-cost solution for sensing,...

Published: 1/10/2024 | Inventor(s): Aydin Babakhani, Seyedmohammadre Razavian

Keywords(s): Active Antenna, Antenna (Radio), Antenna (Radio) Flip Chip DisplayPort, Antennas/Wireless, Application-Specific Integrated Circuit, Communication & Networking, Continuous Wave, Continuous-Wave Radar, Diode, Doping (Semiconductor), Elastomer Static Pressure Pulse Wave, Electronics & Semiconductors, Frequency conversion, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), Laser Diode, Light-Emitting Diode, Light-Emitting Diode Monochrome Inkjet Printing, Microelectronics Semiconductor Device Fabrication, Microstrip Antenna, Microwave, Microwave Base Transceiver Station, Microwave Microwave Video Scaler, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, Network Analysis (Electrical Circuits), Optoelectronics Waveguide (Electromagnetism), Organic Semiconductor, Patch Antenna, Patch Antenna Mobile Phone, Phase (Waves), Photodiode, Photonic Integrated Circuit, PIN Diode, Printed Circuit Board, Radar / Antennae, Radio Frequency Sine Wave, Radiodensity, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, Smart Antenna, Standing Wave, Telecommunication, Three-Dimensional Integrated Circuit, Waveform, Waveguide, Waveguide (Electromagnetism), Waveguide Light, Waveguide Waveguide (Electromagnetism), Wavelength, zzsemiconducting materials

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials > Semiconducting Materials, Electrical > Wireless

2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs

Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer, Haoxiang Ren, Saptadeep Pal

Keywords(s): Amorphous Silicon, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, Artificial Neural Network, Bandwidth (Signal Processing), Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Clock Signal, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Machine Learning, Machine Vision, Manufacturing, Microelectronics Semiconductor Device Fabrication, Microprocessor, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Supercomputer, System On A Chip, Tablet Computer

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Circuits, Software & Algorithms > Artificial Intelligence & Machine Learning

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