Search Results - takafumi+fukushima

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2017-212 Flexible Fan Out Wafer Processing and Structure: FlexTrate

Flexible Fan Out Wafer Processing And Structure: FlextrateSUMMARYUCLA researchers in the Department of Electrical Engineering have invented a novel biocompatible flexible device fabrication method using fan-out wafer level processing (FOWLP).BACKGROUNDConventional device and substrate technologies require the use of rigid substrates, and it is common...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer, Takafumi Fukushima, Adeel Bajwa

Keywords(s): Nanosensor

Category(s): Materials > Fabrication Technologies, Electrical > Electronics & Semiconductors > Waferscale Computing

2018-219 FLEXIBLE AND STRETCHABLE INTERCONNECTS FOR FLEXIBLE SYSTEMS

Summary: Researchers led by Professor Subramanian Iyer from the Department of Electrical and Computer Engineering at UCLA have developed a novel fabrication technique to create stretchable electronics. Background: Constant improvements to electronics fabrication techniques have allowed higher density packaging of dies, a small block of silicon upon...

Published: 7/19/2023 | Inventor(s): Arsalan Alam, Amir Hanna, Takafumi Fukushima, Subramanian Iyer

Keywords(s): General Device Coatings, Medical Devices and Materials, Other

Category(s): Medical Devices, Medical Devices > Coatings