Search Results - consumer+electronics

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A New ADC Architecture (Case No. 2023-276)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel analog-digital conversion (ADC) Architecture that achieves high-speed, high-resolution signal conversion with reduced power consumption and increased linearity. Background: High-speed, high-resolution analog-digital converters (ADCs) are what...

Published: 4/11/2024 | Inventor(s): Utkarsh Sharma, Behzad Razavi

Keywords(s): Computer Architecture, Consumer Electronics, Digital Electronics, Digital Signal Processing, Integrated Circuit, processor design, quantum communication, Quantum Computer, Quantum Dot, quantum error correction (QEC), quantum incompressible fluid, quantum key, quantum network, quantum processing, quantum processor, Signal Processing, trapped ion quantum processor

Category(s): Electrical > Signal Processing, Electrical > Computing Hardware

Headar: Sensing Head Gestures for Smartwatches With Wearable Radar (Case No. 2023-265)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed Headar, a wearable radar that can be implemented in smartwatches to detect head gestures. Background: Smartwatches have recently experienced rapid technological advancement and gained a large popularity due to their wide variety of applications features...

Published: 12/15/2023 | Inventor(s): Yang Zhang, Xiaoying Yang, Eiji Hayashi

Keywords(s): Antennas/Wireless, Consumer Electronics, Electronics & Semiconductors, head gesture, millimeter-wave, Radar, Radar / Antennae, Semiconductor, Semiconductor Device, Semiconductors, Smart Antenna, Smart Material, smart sensing, Smartphone, Smartwatch, wearable

Category(s): Software & Algorithms, Software & Algorithms > Ar/Vr, Electrical, Electrical > Wireless, Electrical > Sensors, Electrical > Wireless > Antennas

2021-229 Processes, Equipment and Materials Recipes, and Related Know-How to Perform the Silicon-Interconnect Fabric (Si-IF) Chip-Scale Packaging Technology

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel manufacturing process for Silicone-Interconnect Fabric (Si-IF) that is not only scalable, but also robust as it relies on established processing techniques from CMOS technologies. Background: With the rise of computation-heavy applications, such...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer

Keywords(s): Analogue Electronics, CMOS, Consumer Electronics, Digital Electronics, Electronic Packaging, Electronics & Semiconductors, electronics packaging, heterogenous electronic systems, Integrated Circuit Via (Electronics), Interposers, Nanotechnology, Power Electronics, Printed Circuit Board, Printed Electronics, Silicon

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Nanotechnology, Electrical > Electronics & Semiconductors > Memory