Search Results - signal+processing

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A New ADC Architecture (Case No. 2023-276)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel analog-digital conversion (ADC) Architecture that achieves high-speed, high-resolution signal conversion with reduced power consumption and increased linearity. Background: High-speed, high-resolution analog-digital converters (ADCs) are what...

Published: 4/11/2024 | Inventor(s): Utkarsh Sharma, Behzad Razavi

Keywords(s): Computer Architecture, Consumer Electronics, Digital Electronics, Digital Signal Processing, Integrated Circuit, processor design, quantum communication, Quantum Computer, Quantum Dot, quantum error correction (QEC), quantum incompressible fluid, quantum key, quantum network, quantum processing, quantum processor, Signal Processing, trapped ion quantum processor

Category(s): Electrical > Signal Processing, Electrical > Computing Hardware

Dual-Stage On-Chip Optical-To-Microwave Low-Noise Synthesizer (Case No. 2022-059)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed the Dual-Stage On-Chip Optical-To-Microwave Low-Noise Synthesizer, which achieves exceptional phase-noise performance by combining optical and microwave components and is poised to improve telecommunications efficiencies. Background: The field of low-noise...

Published: 4/11/2024 | Inventor(s): Chee Wei Wong, Abhinav Kumar Vinod

Keywords(s): Electronics & Semiconductors, Microwave, Optics, Photonics, Semiconductor, Signal Processing, Signal-To-Noise Ratio, Wireless

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Electrical > Wireless, Optics & Photonics

Parametrically Driven Intertial Sensing in Chip-Scale Optomechanical Cavities at the Thermodynamical Limits with Extended Dynamic Range (Case No. 2023-282)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed an accelerometer model that uses optomechanical transduction, enabling higher precision motion detection through a simplified design. Background: Modern transportation and communication technologies rely on the measurement and transduction of minute...

Published: 1/22/2024 | Inventor(s): Chee Wei Wong, Jaime Flores

Keywords(s): accelerometer, cavity optomechanics, Force sensor, inertial sensor, motion detection, Optoelectronics, Optomechanical accelerometer, Sensors, Signal Processing, Voltage-Controlled Oscillator

Category(s): Electrical, Electrical > Signal Processing, Electrical > Sensors

2022-048 Flexible Radiofrequency (RF) Coil for Small Field-Of-View Magnetic Resonance Imaging (MRI)

Summary: UCLA researchers in the Department of Neurosurgery have developed a miniature flexible radiofrequency coil for MRI for the detection of small pathological lesions. Background: Magnetic resonance imaging (MRI) is a widely-used medical imaging modality, which can produce clear and contrasted pictures of human anatomy by utilizing magnetism...

Published: 7/19/2023 | Inventor(s): Marvin Bergsneider, Robert Candler, Kyung Hyun Sung, Siyuan Liu, Jiahao Lin

Keywords(s): coil design, coil simulation, Endoscopes, endoscopic devices, endoscopic endonasal surgery, Endoscopy, High-resolution, Image Resolution, MRI, pituitary gland, pituitary microadenomas, pituitary tumors, Radio Frequency Coil Human Factors And Ergonomics, radiofrequency (RF) coil, Radiofrequency Ablation, Signal Processing, Signal-To-Noise Ratio, Simulation & Modeling, simulation model, Spatial Multiplexing, spatial resolution, Surgery

Category(s): Life Science Research Tools, Life Science Research Tools > Microscopy And Imaging, Diagnostic Markers, Medical Devices, Medical Devices > Medical Imaging, Medical Devices > Monitoring And Recording Systems, Platforms > Diagnostic Platform Technologies, Medical Devices > Medical Imaging > MRI

2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs

Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer, Haoxiang Ren, Saptadeep Pal

Keywords(s): Amorphous Silicon, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, Artificial Neural Network, Bandwidth (Signal Processing), Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Clock Signal, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Machine Learning, Machine Vision, Manufacturing, Microelectronics Semiconductor Device Fabrication, Microprocessor, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Supercomputer, System On A Chip, Tablet Computer

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Circuits, Software & Algorithms > Artificial Intelligence & Machine Learning

Silicon Interconnect Fabric (Si-IF) Technologies - Subramanian Iyer

Background: Over the past two decades, silicon chips have decreased in size by 1000x, while packages on circuit boards have only shrunk by 4x. This will eventually limit scaling of integrated circuits and subsequent processor performance. A solution is the invention of platforms for packageless integration of heterogeneous dies, such as silicon interconnect...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer

Keywords(s): Amorphous Silicon, Antenna (Radio) Flip Chip DisplayPort, Application-Specific Integrated Circuit, Bandwidth (Signal Processing), Bandwidth (Signal Processing) RF Transmitters, Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Brain Stimulation, Electrical Breakdown, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Load Equation Of State, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Enzyme Substrate (Biology), Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Image Processing, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), Lab-On-A-Chip, Microelectronics Semiconductor Device Fabrication, Microprocessor, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Photonic Integrated Circuit, Printed Circuit Board, Process Optimization, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Substrate (Chemistry), Supercomputer, System On A Chip, Tablet Computer, Three-Dimensional Integrated Circuit, Transcutaneous Electrical Nerve Stimulation, zzsemiconducting materials

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Semiconducting Materials, Medical Devices, Medical Devices > Coatings

2019-872 Methods and Apparatus to Impute Physiological Signals and Derivative Absolute Values in Real-Time Using Machine Learning Approaches from Independent Data Sources

SUMMARYResearchers led by Drs. Maxime Cannesson and Eran Halperin at UCLA have developed a way to predict arterial blood pressure waveforms using EKG and SpO2 waveforms.BACKGROUNDMonitoring and measuring vital physiological signals like arterial blood pressure (ABP) is critical for successful surgery. Ideally these types of signals should be measured...

Published: 7/19/2023 | Inventor(s): Maxime Cannesson, Brian Hill, Eran Halperin, Ira Hofer, Nadav Rakocz

Keywords(s): Advanced Computing / AI, Anesthesiology, Artifical Intelligence (Machine Learning, Data Mining), Bioinformatics, Digital Health, Hospital Systems And Devices, Monitoring And Recording Systems, Signal Processing, Simulation & Modeling, Software, Software & Algorithms

Category(s): Medical Devices > Monitoring And Recording Systems, Platforms > Diagnostic Platform Technologies, Software & Algorithms > Data Analytics, Software & Algorithms > Bioinformatics, Software & Algorithms > Programs