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Multilevel Buffered Link (Case No. 2025-284)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel on-chip link that enhances communication performance and energy efficiency in modern integrated circuits. Background: On-chip communication enables data transfer between microchip components and is critical in computing, automotive, and industrial...

Published: 8/20/2025 | Inventor(s): Sudhakar Pamarti, Chih-Kong Yang, Haris Suhail

Keywords(s): Bandwidth (Signal Processing), buffer layer, Clock Signal, efficiency bandwidth products, Electrical, Electrical Engineering, Energy Efficiency, energy efficient IoT, energy-efficient, high-data-rate links, high-speed communications, IoT communication, large bandwidth, low-power device, Network On A Chip, scalable communication, scalable fabrication, Signaling pathways, Signal-To-Noise Ratio, System On A Chip

Category(s): Electrical, Electrical > Electronics & Semiconductors > Circuits, Electrical > Computing Hardware, Software & Algorithms > Communication & Networking, Electrical > Signal Processing