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Non-Destructive Probes for Known Good Die and Assembly Testing (Case No. 2026-073)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a liquid-metal-based, nondestructive probing platform for high-density semiconductor die and assembly testing. Background: As semiconductor devices become smaller and more complex, manufacturers face growing challenges in testing chips before they are...

Published: 3/2/2026 | Inventor(s): Subramanian Iyer, Samuel Wang

Keywords(s): biocompatible, Chipset, dielet assembly, Electrical, Electrical Engineering, Electronic Packaging, electronics packaging, high throughput testing, Liquid metal particles, liquid metals, low-cost fabrication, MEMS, micro-electromechanical systems (MEMS), Microelectronics Semiconductor Device Fabrication, scalable fabrication, Semiconductor, Semiconductor Device Fabrication, Semiconductors, soft electrical circuits, wafer-scale

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Fabrication Technologies, Materials > Semiconducting Materials, Mechanical > Manufacturing, Mechanical > Micro-Electromechanical Systems (Mems)

Superconducting Diodes for Qubit Readout (Case No. 2026-079)

Summary: UCLA researchers led by Professor Pri Narang have developed a fully superconducting, on-chip readout architecture that improves signal fidelity and limits backpropagation in quantum processors Background: Superconducting quantum processors can perform complex calculations orders of magnitude quicker than classical computers. Current superconducting...

Published: 3/3/2026 | Inventor(s): Prineha Narang, Arpit Arora, Nicolas Dirnegger

Keywords(s):

Category(s): Electrical, Electrical > Quantum Computing, Electrical > Signal Processing, Electrical > Sensors, Electrical > Instrumentation, Electrical > Computing Hardware, Materials, Materials > Fabrication Technologies, Materials > Functional Materials, Materials > Semiconducting Materials

Superconducting Diodes for Qubit-Qubit Coupling (Case No. 2026-078)

Summary: UCLA researchers in the Department of Electrical Engineering have developed a superconducting diode-based nonreciprocal interconnect that enables low-loss, directional microwave signal routing between qubits, chips, and cryogenic modules while preserving quantum coherence and suppressing back-propagating noise. Background: Scalable superconducting...

Published: 3/3/2026 | Inventor(s): Prineha Narang, Nicolas Dirnegger, Arpit Arora

Keywords(s): Communication & Networking, cryogenic cooling, device architectures, Diode, Electrical Impedance, entanglement, Microwave, Network On A Chip, quantum communication, Quantum Computer, quantum network, quantum processing, quantum processor, scalable communication, transmission enhancement

Category(s): Electrical, Electrical > Quantum Computing, Electrical > Computing Hardware, Energy & Environment > Energy Transmission, Electrical > Signal Processing

Diamond Needle Insertion Technique for High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...

Published: 2/20/2026 | Inventor(s): Tiwei Wei

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)

Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors

Through-Glass Vias (TGVS) Thermal Management Using Diamond-Assisted Copper Metallization for Advanced 3DIC Packaging (Case No. 2026-156)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...

Published: 2/23/2026 | Inventor(s): Tiwei Wei, Ye Yang

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials

Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking

Highly Miniaturized Closed-Loop Biosensing and Drug Delivery (Case No. 2025-276)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed an implantable closed-loop system that integrates electrochemical biosensing, wireless signal transmission, and programmable drug release. Background: Conventional disease management systems rely on single-point measurements and discrete interval drug...

Published: 2/5/2026 | Inventor(s): Aydin Babakhani, Iman Habibagahi, Hamid Jafarisharemi, Roshan Mathews

Keywords(s): biomedical implantation, biomedical sensors, Drug Delivery, Drug monitoring, Implant (Medicine), implantable sensors, Medical Device, minimally invasive drug delivery systems, on-demand drug delivery, personalized dose assessment, Smart medical device, Therapeutics, wearable, wearable electronics, wearable medical device, wearable medical devices, wearable sensors, wearable sensors for health, Wireless, wireless communication

Category(s): Life Science Research Tools, Electrical, Medical Devices, Platforms > Diagnostic Platform Technologies, Platforms > Drug Delivery, Platforms

A Selenium Buffer Method for Making Van Der Waals Contact on CDTE Wafers With High Surface Roughness (Case No. 2025-173)

Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel method for implementation of Van der Waals contact on commercial CdTe wafers for improved photovoltaic and solar panel production. Background: Cadmium Telluride (CdTe) is a common absorber used for thin-film optoelectronics and photovoltaics, including...

Published: 1/28/2026 | Inventor(s): Yu Huang, Xiangfeng Duan, Bangyao Hu

Keywords(s):

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Chemical, Chemical > Chemical Processing & Manufacturing, Chemical > Instrumentation & Analysis, Electrical > Sensors, Energy & Environment, Energy & Environment > Energy Efficiency, Energy & Environment > Energy Generation, Materials, Materials > Semiconducting Materials

Θ-Phase Tantalum Nitride for Thermal Management and Electronics Applications (Case No. 2026-180)

Summary: Researchers in UCLA’s Department of Mechanical and Aerospace Engineering have developed a novel transition metal compound that demonstrates what is thought to be the highest thermal conductivity reported among metallic materials. The material is synthesized as a single, defect-free crystal, enabling unprecedented efficiency in heat transport....

Published: 1/20/2026 | Inventor(s): Yongjie Hu

Keywords(s): advanced thermal control materials, Composite Material, Electronics & Semiconductors, energy-efficient, heat control, heat controlling devices, heat dissipation, Heat Transfer, high conductivity, material science, Materials, Metals, nanocrystalline metals, Power Electronics, temperature control, thermal control, thermal control materials, thermal management, thermal management systems, thermal metamaterials

Category(s): Chemical, Chemical > Chemical Processing & Manufacturing, Chemical > Synthesis, Electrical, Electrical > Electronics & Semiconductors > Thermoelectrics, Energy & Environment > Thermal, Materials, Materials > Metals, Mechanical > Heat Transfer

Multi-Level Scheduling and Partitioning of Reconfigurable Processor Arrays (Case No. 2026-011) Circular Elevator Style Network-on-Chip (Case No. 2026-012) and Pattern Compilation for Runtime Reconfigurable Arrays (Case No. 2026-013)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a high-speed runtime reconfigurable processor array (RTRA) that enables on-chip scheduling and rapid multi-program execution with unprecedented energy and area efficiency for dynamic computing workloads. Background: Dynamic digital signal processing...

Published: 12/11/2025 | Inventor(s): Dejan Markovic, Hong Seok Lee, Chenkai Ling

Keywords(s): computational efficiency, computational efficiency and analysis, edge computing, energy-efficient, Hardware, high speed, large-area arrays, low latency computing, low-power architecture, Microarray, Microprocessor, processor design, programming, scalable manufacturing, System On A Chip

Category(s): Electrical > Signal Processing, Electrical, Electrical > Electronics & Semiconductors, Software & Algorithms, Electrical > Computing Hardware

CDMA MIMO Readout Networks for Semiconductor-Based Compact 2-Dimensional Qubit Array (Case No. 2025-153)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel CDMA-MIMO qubit readout network that enables scalable, high-fidelity measurement of two-dimensional semiconductor qubit arrays for fault-tolerant quantum computing. Background: Qubit arrays form the foundation of complex quantum computations...

Published: 12/12/2025 | Inventor(s): Mau-Chung Chang, Jhih-Wei Chen

Keywords(s): computational efficiency, computational efficiency and analysis, Electrical, Electrical Engineering, Electronics & Semiconductors, large-area arrays, quantum communication, Quantum Computer, quantum error correction (QEC), quantum network, quantum processing, quantum processor, Semiconductor, Semiconductor Device, Semiconductors

Category(s): Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Electrical > Quantum Computing, Software & Algorithms > Communication & Networking, Software & Algorithms

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