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Monitoring Structural Health Using Diffractive Optical Processors (Case No. 2025-201)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel structural health monitoring system that is highly accurate and cost effective, addressing limitations in current infrastructure and civil health monitoring and a rise in public safety concerns. Background: The need for structural health monitoring...

Published: 7/23/2026 | Inventor(s): Aydogan Ozcan, Ertugrul Taciroglu, Yuntian Wang, Yuhang Li

Keywords(s): 3D structures, Adaptive Optics, AI-generated images and content, all-optical diffractive computing, all-optical transformation, analog computing, analog optical computing, Analogue Electronics, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, artificial intelligence algorithms, artificial intelligence augmentation, artificial intelligence/machine learning models, artificial-intelligent materials, civil engineering, civil infrastructure, civil monitoring, computational imaging, computational imaging task, Construction, deep diffractive network, Diffraction, diffractive design, diffractive image reconstruction, diffractive network, diffractive processor, diffractive surface, digital image reconstruction, electromagnetic spectrum, Electro-Optics, Image Analysis, Image Processing, Image Resolution, image restoration, image signal processing, Imaging, Infrastructure, Lens (Optics), linear optics, Nanostructure, optical processor, optically-guided structural monitoring, Optics, passive light-matter interactions, security imaging, Signal Reconstruction, Structural health monitoring, structural health monitoring (SHM), structure monitoring, Structures

Category(s): Electrical, Electrical > Signal Processing, Electrical > Imaging, Materials, Materials > Construction Materials, Electrical > Visual Computing, Electrical > Computing Hardware, Electrical > Instrumentation, Energy & Environment, Energy & Environment > Energy Efficiency, Software & Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning, Software & Algorithms > Image Processing, Software & Algorithms > Programs

RSA-Wearable Alertness Detecting Device (Case No. 2025-245)

Summary: UCLA researchers from the Department of Medicine-Pulmonary Disease have developed a novel wearable device to detect alertness and predict the onset of sleep for improved safety. Background: Hypersomnia and excessive daytime sleepiness (EDS) are both symptoms of a broad class of sleeping disorders including obstructive sleep apnea (OSA),...

Published: 7/23/2026 | Inventor(s): Ravi Aysola

Keywords(s): Biomonitoring, Computer Monitor, continuous sleep monitoring, CPAP, Gene Block, non-invasive monitoring, patient outcome, Philips, public health monitoring, remote monitoring, remote patient analysis, remote patient monitoring (RPM), Remote Sensing, sleep apnea, sleep monitoring, sleep monitoring and health, wearable, wearable electronics, wearable medical device, wearable medical devices, wearable sensors, wearable sensors for health

Category(s): Medical Devices, Medical Devices > Monitoring And Recording Systems, Medical Devices > Hospital Systems, Electrical, Electrical > Sensors, Electrical > Flexible Electronics, Platforms, Software & Algorithms, Software & Algorithms > Digital Health, Software & Algorithms > Data Analytics

Method for Reducing Process Variation-Induced Threshold Voltage Mismatch in FD-SOI Transistors (Case No. 2025-271)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a transistor-level method that dynamically tunes device characteristics to eliminate mismatch, achieving higher stability and precision without added area or power costs. Background: Transistors are the fundamental semiconductor building blocks for amplification,...

Published: 7/23/2026 | Inventor(s): Subramanian Iyer, Siyun Qiao, Jacklyn Zhu, Samuel Wang

Keywords(s): device stability, Electronics & Semiconductors, frequency modulation, Integrated Circuit, Integrated Circuit Via (Electronics), Microelectronics Semiconductor Device Fabrication, Mixed-Signal Integrated Circuit, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, Signal Processing, Silicon, Transistor, transistors

Category(s): Electrical, Electrical > Signal Processing, Electrical > Instrumentation, Electrical > Electronics & Semiconductors, Software & Algorithms, Software & Algorithms > Communication & Networking

CDMA MIMO Readout Networks for Semiconductor-Based Compact 2-Dimensional Qubit Array (Case No. 2025-153)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel CDMA-MIMO qubit readout network that enables scalable, high-fidelity measurement of two-dimensional semiconductor qubit arrays for fault-tolerant quantum computing. Background: Qubit arrays form the foundation of complex quantum computations...

Published: 7/23/2026 | Inventor(s): Mau-Chung Chang, Jhih-Wei Chen

Keywords(s): computational efficiency, computational efficiency and analysis, Electrical, Electrical Engineering, Electronics & Semiconductors, large-area arrays, quantum communication, Quantum Computer, quantum error correction (QEC), quantum network, quantum processing, quantum processor, Semiconductor, Semiconductor Device, Semiconductors

Category(s): Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Electrical > Quantum Computing, Software & Algorithms > Communication & Networking, Software & Algorithms

Fine-Grained Power-Gating Circuitry in FPGA Interconnects (Case No. 2013-181)

Summary UCLA researchers have invented a method and circuit architecture for fine-grained power gating within FPGA (field-programmable gate array) interconnects. By selectively disabling (power gating) unused multiplexers and routing segments at a fine granularity, the approach reduces leakage power in FPGA interconnects while preserving performance...

Published: 7/23/2026 | Inventor(s): Chengcheng Wang, Dejan Markovic

Keywords(s):

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Electrical > Computing Hardware, Materials, Materials > Semiconducting Materials

Lens-Free Wide-Field Super-Resolution Imaging (Case No. 2010-598)

Summary Researchers at UCLA have developed a lens-free, wide-field super-resolution imaging platform that uses a scanned illumination aperture and computational reconstruction to overcome the pixel size limit and achieve high-resolution imaging across large fields of view. The system captures multiple low-resolution holograms under shifted illumination...

Published: 7/23/2026 | Inventor(s): Aydogan Ozcan, Waheb Bishara

Keywords(s):

Category(s): Electrical, Electrical > Instrumentation, Medical Devices, Medical Devices > Medical Imaging, Optics & Photonics, Optics & Photonics > Holography, Optics & Photonics > Microscopy, Optics & Photonics > Spectroscopy

Device to Produce X-Rays for Use in Imaging (Case No. 2009-627)

Summary Researchers at UC San Diego have developed a compact, addressable flat-panel x-ray source based on pyroelectric / piezoelectric crystals with integrated field emitters. The design produces electron emission by temperature (or stress) cycling of crystals, which then strike a target to generate x-rays. The array architecture enables selectable...

Published: 7/23/2026 | Inventor(s): Gil Travish, Rodney Yoder, James Rosenzweig

Keywords(s):

Category(s): Electrical, Electrical > Signal Processing, Electrical > Instrumentation, Electrical > Imaging, Medical Devices, Optics & Photonics, Medical Devices > Monitoring And Recording Systems, Medical Devices > Medical Imaging, Medical Devices > Medical Imaging > X-Ray

Continuous Whole-Chip 3-Dimensional Dep Cell Sorter and Its Fabrication (Case No. 2012-612)

Summary Researchers at UCLA have developed a continuous, whole-chip, three-dimensional dielectrophoretic (DEP) cell sorting device, integrating multi-layer microfluidics and electrode geometries to sort cells or particles throughout the thickness of a microfluidic chip, not merely at a single plane. Background Microfluidic cell sorting is vital in...

Published: 7/23/2026 | Inventor(s): Pei-Yu Chiou, Yu Jui Fan, Yu Chun Kung, Kuo Wei Huang

Keywords(s):

Category(s): Life Science Research Tools, Life Science Research Tools > Cell Counting And Imaging, Optics & Photonics, Optics & Photonics > Microscopy, Electrical, Electrical > Imaging

Θ-Phase Tantalum Nitride for Thermal Management and Electronics Applications (Case No. 2026-180)

Summary: Researchers in UCLA’s Department of Mechanical and Aerospace Engineering have developed a novel transition metal compound that demonstrates what is thought to be the highest thermal conductivity reported among metallic materials. The material is synthesized as a single, defect-free crystal, enabling unprecedented efficiency in heat transport....

Published: 7/23/2026 | Inventor(s): Yongjie Hu

Keywords(s): advanced thermal control materials, Composite Material, Electronics & Semiconductors, energy-efficient, heat control, heat controlling devices, heat dissipation, Heat Transfer, high conductivity, material science, Materials, Metals, nanocrystalline metals, Power Electronics, temperature control, thermal control, thermal control materials, thermal management, thermal management systems, thermal metamaterials

Category(s): Chemical, Chemical > Chemical Processing & Manufacturing, Chemical > Synthesis, Electrical, Electrical > Electronics & Semiconductors > Thermoelectrics, Energy & Environment > Thermal, Materials, Materials > Metals, Mechanical > Heat Transfer

Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...

Published: 7/23/2026 | Inventor(s): Tiwei Wei, Ye Yang

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials

Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking

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