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Active Electromagnetic Interference Suppression for Magnetic Resonance Imaging-Guided Interventions (Case No. 2026-217)

Summary: UCLA researchers in the Department of Radiological Sciences have developed a software-based active electromagnetic interference suppression solution for real-time MRI-guided interventions. Background: Microwave ablation (MWA) has emerged as the preferred thermal ablation modality for treating non-surgical patients with primary and metastatic...

Published: 4/16/2026 | Inventor(s): Holden Wu, Qing Dai

Keywords(s):

Category(s): Software & Algorithms, Software & Algorithms > AI Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning, Software & Algorithms > Image Processing, Medical Devices, Medical Devices > Medical Imaging, Medical Devices > Medical Imaging > MRI, Life Science Research Tools, Life Science Research Tools > Microscopy And Imaging, Life Science Research Tools > Lab Equipment, Medical Devices > Monitoring And Recording Systems, Therapeutics, Therapeutics > CNS and Neurology, Therapeutics > Immunology And Immunotherapy, Therapeutics > Inflammation And Inflammatory Diseases, Mechanical, Mechanical > Instrumentation, Mechanical > Sensors, Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Electrical > Instrumentation, Electrical > Imaging

Architecture and Level 2 Variable Power Control Scheme (Case No. 2013-146)

Summary: UCLA researchers in the Department of Mechanical & Aerospace Engineering have developed a smart EV charging architecture that dynamically optimizes EV charging loads based on real-time grid capacity and limitations. Background: The rapid increase in electric vehicle (EV) adoption creates a critical need for robust and accessible charging...

Published: 4/7/2026 | Inventor(s): Rajit Gadh, Ching Yen Chung, Chi Cheng Chu, Li Qiu

Keywords(s): Charge Carrier, charge collection, charge collection efficiency, charge extraction, charge sharing, charge summing, charged particle beams, charge-transfer, Electric Current, Electric Vehicle, electric vehicle charging, Electrical, Electrical Impedance, Electrical Load, Energy Harvesting Evaporation, EV battery cooling, grid efficiency, grid energy, Power distribution & grids, Rechargeable Battery, Rechargeable Battery Thermal Conductivity, Smart Grid, supercharger, Surface Charge, vehicle charging

Category(s): Electrical, Energy & Environment, Energy & Environment > Energy Efficiency, Energy & Environment > Energy Generation, Energy & Environment > Energy Storage, Energy & Environment > Energy Transmission

Magnetically Levitated Inertial Sensor Using Split Magnetic Dipoles (Case No. 2026-191)

Summary: Researchers in the UCLA Department of Electrical and Computer Engineering have developed a magnetically levitated inertial sensor based on a split magnetic dipole architecture. The anchorless design enables high quality factor (Q) gyroscopic sensing with independently tunable sensitivity and bandwidth, providing a robust solution for precision...

Published: 4/2/2026 | Inventor(s): Robert Candler, Amy Sihn, Vaibhav Sharma, Martin Simon

Keywords(s): accelerometer, Autonomous driving, Bandwidth (Signal Processing), Communications Satellite, high sensitivity, inertial sensor, interactive sensing application, marine applications, MEMS, micro-electromechanical systems (MEMS), Motion analysis, motion detection, real-time sensing/monitoring/tracking, scalable fabrication, Vibration sensing

Category(s): Electrical, Electrical > Mems, Electrical > Sensors, Mechanical, Mechanical > Micro-Electromechanical Systems (Mems), Mechanical > Sensors, Mechanical > Mechanical Systems

Deep Learning-Enhanced Dual-Mode Multiplexed Optical Sensor for Point-Of-Care Diagnostics of Cardiovascular Diseases (Case No. 2026-178)

Summary: UCLA researchers in the Departments of Electrical and Computer Engineering and Bioengineering have developed a deep-learning-enhanced multiplexed optical biosensing platform that enables rapid, high sensitivity point-of-care quantification of multiple cardiac biomarkers for cardiovascular diagnostics. Background: Rapid and accessible cardiac...

Published: 3/24/2026 | Inventor(s): Aydogan Ozcan, Dino Di Carlo, Gyeo-Re Han, Artem Goncharov, Merve Eryilmaz

Keywords(s): Biomarker, biomarkers, Cardiovascular, Cardiovascular Disease, cardiovascular diseases, cardiovascular monitoring, cardiovascular therapeutic solution, Deep Learning, Deep learning-based sensing, deep neural networks (DNN), neural network, neural networks, Optics, Point Of Care, point-of-care, point-of-care testing

Category(s): Electrical, Optics & Photonics, Diagnostic Markers, Medical Devices > Cardiac, Medical Devices

Non-Destructive Probes for Known Good Die and Assembly Testing (Case No. 2026-073)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a liquid-metal-based, nondestructive probing platform for high-density semiconductor die and assembly testing. Background: As semiconductor devices become smaller and more complex, manufacturers face growing challenges in testing chips before they are...

Published: 3/2/2026 | Inventor(s): Subramanian Iyer, Samuel Wang

Keywords(s): biocompatible, Chipset, dielet assembly, Electrical, Electrical Engineering, Electronic Packaging, electronics packaging, high throughput testing, Liquid metal particles, liquid metals, low-cost fabrication, MEMS, micro-electromechanical systems (MEMS), Microelectronics Semiconductor Device Fabrication, scalable fabrication, Semiconductor, Semiconductor Device Fabrication, Semiconductors, soft electrical circuits, wafer-scale

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Fabrication Technologies, Materials > Semiconducting Materials, Mechanical > Manufacturing, Mechanical > Micro-Electromechanical Systems (Mems)

Superconducting Diodes for Qubit Readout (Case No. 2026-079)

Summary: UCLA researchers led by Professor Pri Narang have developed a fully superconducting, on-chip readout architecture that improves signal fidelity and limits backpropagation in quantum processors Background: Superconducting quantum processors can perform complex calculations orders of magnitude quicker than classical computers. Current superconducting...

Published: 3/3/2026 | Inventor(s): Prineha Narang, Arpit Arora, Nicolas Dirnegger

Keywords(s):

Category(s): Electrical, Electrical > Quantum Computing, Electrical > Signal Processing, Electrical > Sensors, Electrical > Instrumentation, Electrical > Computing Hardware, Materials, Materials > Fabrication Technologies, Materials > Functional Materials, Materials > Semiconducting Materials

Superconducting Diodes for Qubit-Qubit Coupling (Case No. 2026-078)

Summary: UCLA researchers in the Department of Electrical Engineering have developed a superconducting diode-based nonreciprocal interconnect that enables low-loss, directional microwave signal routing between qubits, chips, and cryogenic modules while preserving quantum coherence and suppressing back-propagating noise. Background: Scalable superconducting...

Published: 3/3/2026 | Inventor(s): Prineha Narang, Nicolas Dirnegger, Arpit Arora

Keywords(s): Communication & Networking, cryogenic cooling, device architectures, Diode, Electrical Impedance, entanglement, Microwave, Network On A Chip, quantum communication, Quantum Computer, quantum network, quantum processing, quantum processor, scalable communication, transmission enhancement

Category(s): Electrical, Electrical > Quantum Computing, Electrical > Computing Hardware, Energy & Environment > Energy Transmission, Electrical > Signal Processing

Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...

Published: 3/5/2026 | Inventor(s): Tiwei Wei

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)

Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors

Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...

Published: 3/5/2026 | Inventor(s): Tiwei Wei, Ye Yang

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials

Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking

Highly Miniaturized Closed-Loop Biosensing and Drug Delivery (Case No. 2025-276)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed an implantable closed-loop system that integrates electrochemical biosensing, wireless signal transmission, and programmable drug release. Background: Conventional disease management systems rely on single-point measurements and discrete interval drug...

Published: 2/5/2026 | Inventor(s): Aydin Babakhani, Iman Habibagahi, Hamid Jafarisharemi, Roshan Mathews

Keywords(s): biomedical implantation, biomedical sensors, Drug Delivery, Drug monitoring, Implant (Medicine), implantable sensors, Medical Device, minimally invasive drug delivery systems, on-demand drug delivery, personalized dose assessment, Smart medical device, Therapeutics, wearable, wearable electronics, wearable medical device, wearable medical devices, wearable sensors, wearable sensors for health, Wireless, wireless communication

Category(s): Life Science Research Tools, Electrical, Medical Devices, Platforms > Diagnostic Platform Technologies, Platforms > Drug Delivery, Platforms

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