Search Results - electrical+engineering

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Feedback-Free Relays for Future 5G, 6G and mmWave Networks (Case No. 2024-188)

Summary: Researchers in the Department of Computer Science have developed a novel relay system to increase the range of 5G and 6G wireless networks. Background: Advances in high-speed computing have created emerging technologies like telesurgery, robotic automation, and augmented reality that have wide-ranging applications in many fields. These...

Published: 10/23/2024 | Inventor(s): Omid Abari, Tianxiang Li, Mohammad Hossein Mazaheri Kalahrody

Keywords(s): Antennas/Wireless, Duplex (Telecommunications), Electrical, Electrical Engineering, electrically small antennas (ESAs), energy-efficient wireless communication, self-powered wireless sensor solutions, signal decoding, Signal Processing, Signal-To-Noise Ratio, Telecom & Data, Telecommunication, Wireless, wireless capsule endoscopy, wireless communication, wireless connectivity, wireless energy harvesting, Wireless LAN LTE (Telecommunication), Wireless Sensor Network, wireless spectrum

Category(s): Electrical, Electrical > Signal Processing, Electrical > Wireless, Electrical > Wireless > Antennas

Bringing Millimeter Wave Technology to Any IOT Device (Case No. 2023-280)

Summary: UCLA researchers in the Department of Computer Science have developed a novel method of enabling any existing Internet of Things (IoT) device to operate at higher frequencies of the wireless spectrum. Background: The growing presence of smart devices that can communicate, sense, and process data places demands on current wireless networks....

Published: 10/28/2024 | Inventor(s): Mohammad Hossein Mazaheri Kalahrody, Joerg Widmer, Domenico Giustiniano, Rafael Ruiz, Omid Abari

Keywords(s): BLE, Communication & Networking, Communications Satellite, device enhancement, downlink, Electrical, Electrical Brain Stimulation, Electrical Breakdown, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Load Equation Of State, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, electrically small antennas (ESAs), electrically-mediated sensing, energy efficient IoT, energy-efficient wireless communication, Internet of Things (IoT), IoT communication, IoT connectivity, LoRa, low-power device, Network Analysis (Electrical Circuits), operating range, Optical Communication , power conversion efficiency, quantum communication, RGID, scalable communication, smart connectivity, smart technology, strength-electrical conductivity, Telecommunication, Transcutaneous Electrical Nerve Stimulation, uplink, WiFi, wireless communication, wireless connectivity, wireless spectrum

Category(s): Electrical, Electrical > Wireless, Software & Algorithms, Software & Algorithms > Communication & Networking

Field-Effect Transistor Biosensors Integrated With Porous Media (Case No. 2023-093)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering in collaboration with the University of Chicago have developed a new diagnostic biosensor by combining field-effect transistors with porous media. Background: Point-of-care (POC) and self-testing tools rely on the real-time monitoring of biomarkers in bodily fluids....

Published: 4/1/2024 | Inventor(s): Aydogan Ozcan, Hyou-Arm Joung, Hyun-June Jang, Junhong Chen

Keywords(s): Biomarker, biomarkers, Biomaterial, Biosensor, Computer-Aided Diagnosis, Diagnostic Markers & Platforms, Diagnostic Platform Technologies (E.G. Microfluidics), Diagnostic Test, Electrical, Electrical Engineering, electrically-mediated sensing, electrochemical sensors, enzyme functionalization, Medical diagnostics, multiplexed analysis, Point Of Care, point-of-care, porous media, sample matrix effects, transistors

Category(s): Electrical, Electrical > Sensors, Medical Devices, Medical Devices > Monitoring And Recording Systems, Diagnostic Markers, Diagnostic Markers > Targets And Assays, Platforms, Platforms > Diagnostic Platform Technologies

Rapid Sensing of Hidden Objects and Defects Using a Single-Pixel Diffractive Terahertz Processor (Case No. 2023-184)

Summary: UCLA researchers have developed a diffractive sensor that leverages deep-learning-optimized diffractive layers to rapidly detect hidden objects and defects within a 3D sample without scanning or image processing. Background: Inspecting hidden structures is a critical requirement in various fields, including security, manufacturing, and...

Published: 6/13/2024 | Inventor(s): Aydogan Ozcan, Jingxi Li

Keywords(s): Deep learning-based sensing, Electrical, Electrical Engineering, Image Processing, Machine Learning, real-time sensing/monitoring/tracking, Remote Sensing, smart sensing, target detection

Category(s): Electrical, Electrical > Sensors, Optics & Photonics > Spectroscopy, Software & Algorithms > Artificial Intelligence & Machine Learning

Stain-Free, Rapid, and Quantitative Viral Plaque Assay Using Deep Learning and Holography (Case No. 2022-326)

Intro Sentence: UCLA researchers in the Department of Electrical and Computer Engineering have developed a rapid and stain-free quantitative assay using lens-free holography and deep learning to efficiently and cost-effectively determine the presence of viral plaque-forming units (PFUs) in samples. Background: A broad range of viruses have caused...

Published: 10/17/2024 | Inventor(s): Aydogan Ozcan, Yuzhu Li, Tairan Liu

Keywords(s): Antiviral Drug, Artifical Intelligence (Machine Learning, Data Mining), Assay, Bioassay, Computer Aided Learning, Diagnostic Markers & Platforms, Diagnostic Platform Technologies (E.G. Microfluidics), Diagnostic Test, Digital Holography, Electrical, Electrical Brain Stimulation, Electrical Breakdown, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Load Equation Of State, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Holography, Immunoassay, Immunoassay Sense (Molecular Biology), Lentivirus Viral Vector, Machine Learning, Machine Learning Autonomous Car Gradient Descent, Machine Learning Pain Management, Machine Learning Particulates Global Climate Model, Network Analysis (Electrical Circuits), Perceptual Learning, Plasmid Trabecular Meshwork Aqueous Humour Viral Vector, Targets And Assays, Transcutaneous Electrical Nerve Stimulation, Transfection Viral Vector, Unsupervised Learning , Viability Assay, Viral Delivery Systems, Viral Envelope, Viral Load

Category(s): Diagnostic Markers, Diagnostic Markers > Targets And Assays, Electrical, Life Science Research Tools, Life Science Research Tools > Research Methods, Life Science Research Tools > Other Reagents, Software & Algorithms > Artificial Intelligence & Machine Learning

2022-230 Polarization Multiplexed Diffractive Computing: All-Optical Implementation of a Group of Linear Transformations Through a Polarization-Encoded Diffractive Network

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed an all-optical diffractive network that can find applications in machine learning-related vision tasks and all-optical computing systems. Background: Optical computing is a gateway to the future, as it can revolutionize computation by making classically...

Published: 8/21/2023 | Inventor(s): Aydogan Ozcan, Jingxi Li

Keywords(s): Advanced Computing / AI, all-optical diffractive computing, all-optical transformation, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, artificial-intelligent materials, classification, Deep Learning, diffractive network, diffractive processor, Electrical, Electrical Engineering, Internet of Things (IoT), Machine Vision, machine vision task, multiplexing, Optical Coherence , Optical Communication , Optical Fiber Copper Wire And Cable, Optical Microscope, Optics, polarization multiplexed diffractive processor, polarization multiplexing, polarization-based machine vision tasks, polarization-encoded diffractive network

Category(s): Electrical, Electrical > Instrumentation, Software & Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning, Software & Algorithms > Data Analytics, Optics & Photonics, Electrical > Electronics & Semiconductors

2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs

Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer, Haoxiang Ren, Saptadeep Pal

Keywords(s): Amorphous Silicon, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, Artificial Neural Network, Bandwidth (Signal Processing), Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Clock Signal, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Machine Learning, Machine Vision, Manufacturing, Microelectronics Semiconductor Device Fabrication, Microprocessor, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Supercomputer, System On A Chip, Tablet Computer

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Circuits, Software & Algorithms > Artificial Intelligence & Machine Learning

Silicon Interconnect Fabric (Si-IF) Technologies - Subramanian Iyer

Background: Over the past two decades, silicon chips have decreased in size by 1000x, while packages on circuit boards have only shrunk by 4x. This will eventually limit scaling of integrated circuits and subsequent processor performance. A solution is the invention of platforms for packageless integration of heterogeneous dies, such as silicon interconnect...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer

Keywords(s): Amorphous Silicon, Antenna (Radio) Flip Chip DisplayPort, Application-Specific Integrated Circuit, Bandwidth (Signal Processing), Bandwidth (Signal Processing) RF Transmitters, Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Brain Stimulation, Electrical Breakdown, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Load Equation Of State, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Enzyme Substrate (Biology), Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Image Processing, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), Lab-On-A-Chip, Microelectronics Semiconductor Device Fabrication, Microprocessor, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Photonic Integrated Circuit, Printed Circuit Board, Process Optimization, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Substrate (Chemistry), Supercomputer, System On A Chip, Tablet Computer, Three-Dimensional Integrated Circuit, Transcutaneous Electrical Nerve Stimulation, zzsemiconducting materials

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Semiconducting Materials, Medical Devices, Medical Devices > Coatings

Charge Trap Transistors - Subramanian Iyer

Background: Due to their chemical makeup and heat generation, devices such as high-k/metal gate (HKMG) CMOS often accumulate charges can lead to variation in integrated circuits. Charge Trap Transistors (CTT's) utilize accumulating charge in semiconducting devices as embedded non-volatile memory (eNVM). The introduction of CTT's can prove an...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer

Keywords(s): Charge Carrier, CMOS, Dynamic Random-Access Memory, Electrical, Electrical Engineering, Electrical Load, Electrical Resistance And Conductance, Logic Gate, Magnetoresistive Random-Access Memory, Medical Device, Memory, Power Electronics, Power Transmission, Programmable Logic Device, Random-Access Memory, Resistive Random-Access Memory, Semiconductor Device, Semiconductor Device Fabrication, Static Random-Access Memory, Transistor

Category(s): Electrical, Electrical > Electronics & Semiconductors > Memory, Electrical > Electronics & Semiconductors

Waferscale Computing, Emerging Memory Systems, and Lightweight Machine Learning Systems - Puneet Gupta

2022-051 Reliable and Fault-Tolerant Clock Generation and Distribution for Chiplet-Based Waferscale Processors Researchers at UCLA have developed an on-chip fast clock which can be integrated into each chiplet. By doing this, the fast clock can be propagated from one chiplet to another. This provides consistent clock signaling to large systems as well...

Published: 7/19/2023 | Inventor(s): Puneet Gupta

Keywords(s): Artificial Intelligence, Chipset, DDR4 SDRAM, Electrical Engineering, Electronics & Semiconductors, Semiconductor, Semiconductor Device, Semiconductors, Software, Software & Algorithms

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Software & Algorithms > Artificial Intelligence & Machine Learning, Electrical > Electronics & Semiconductors > Memory

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