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Transformer-Based High-Density, Efficient Power Delivery Architecture for Wafer-Scale Integrated Systems (Case No. 2026-075)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a transformer-based, high-density power delivery architecture that enables efficient, scalable, and low-loss energy distribution for next-generation wafer-scale and chiplet-based systems. Background: Chiplet-based and wafer-scale integrated systems demand...

Published: 5/15/2026 | Inventor(s): Subramanian Iyer, Goutham Ezhilarasu, Namkang Lee

Keywords(s): analog computing, Artificial Intelligence, Electrical, energy-efficient, high power electronics, high-performance computing, large-area arrays, power conversion efficiency, Power distribution & grids, Power Electronics, Power Transmission, scalable fabrication, Transformer, wafer-scale, wafer-scale computing, Waferscale Processors

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Energy & Environment > Energy Efficiency, Energy & Environment