Search Results - wafer-scale+computing

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Method of Proficient Typing Using a Limited Number of Classes (Case No. 2024-063)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel software algorithm to rapidly predict text using small keyboards for various applications, including mobile computing, gaming, and human-computer interactions. Background: Advancements in mobile computing have drastically changed everyday life...

Published: 11/6/2024 | Inventor(s): Jonathan Kao, Shreyas Kaasyap, John Zhou, Johannes Lee, Nima Hadidi

Keywords(s): Advanced Computing / AI, advanced computing methods, all-optical diffractive computing, Artificial Neural Network, Artificial Neural Network Artificial Neuron, assistive communication, background radiation, Bandwidth (Computing), Brain computer interface, brain machine interface, Classroom management software, Cloud Computing, composite scintillators, Database management/data entry, deep physical neural network, design software, edge computing, fast scintillators, gamma spectroscopy, graph neural network, HCI (Human Computer Interaction), high-Z organometallics, Human/Brain computer interfaces (BCI/HCI), human-centered computing, material characterization, Medical science computing, mobile computing, modular robotic system, nanocomposite scintillators, neural network, neural networks, neutrino detection, Optical computing, positron emission tomography (PET), predictive text, primary school software, radiation detection, recurrent neural networks, Robotics, robotics control, scintillators, second harmonic generation, secondary school software, self-sustaining computing, soft robotics, Software, Software & Algorithms, Software Development Tools, Software-enabled learning, Spatial computing, Stochastic Computing (SC), T6 keyboard, T9 keyboard, visual computing, wafer-scale computing

Category(s): Software & Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning, Software & Algorithms > Communication & Networking

A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)

Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...

Published: 7/9/2024 | Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren

Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation