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Search Results - electrical+%3e+electronics+%26+semiconductors+%3e+waferscale+computing
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A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)
Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...
Published: 2/16/2024
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Inventor(s):
Subramanian Iyer
,
Krutikesh Sahoo
,
Haoxiang Ren
Keywords(s):
advanced packaging
,
advanced packaging constructs
,
dielet assembly
,
dielet bonding
,
Electronic Packaging
,
electronics packaging
,
Fabrication Technologies
,
face-to-face heterogeneous dielet bonding
,
heterogeneous integration
,
heterogenous electronic systems
,
high throughput
,
Instrumentation
,
Interposers
,
Microelectronics Semiconductor Device Fabrication
,
Organic Semiconductor
,
package scaling
,
Semiconductor
,
semiconductor chip foundries
,
Semiconductor Device
,
Semiconductor Device Fabrication
,
Semiconductors
,
thermal compression bonding
,
wafer-scale
,
wafer-scale computing
,
Waferscale Processors
Category(s):
Electrical
,
Electrical > Electronics & Semiconductors
,
Electrical > Electronics & Semiconductors > Waferscale Computing
,
Materials
,
Materials > Semiconducting Materials
,
Materials > Fabrication Technologies
,
Electrical > Instrumentation
2017-212 Flexible Fan Out Wafer Processing and Structure: FlexTrate
Flexible Fan Out Wafer Processing And Structure: FlextrateSUMMARYUCLA researchers in the Department of Electrical Engineering have invented a novel biocompatible flexible device fabrication method using fan-out wafer level processing (FOWLP).BACKGROUNDConventional device and substrate technologies require the use of rigid substrates, and it is common...
Published: 7/19/2023
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Inventor(s):
Subramanian Iyer
,
Takafumi Fukushima
,
Adeel Bajwa
Keywords(s):
Nanosensor
Category(s):
Materials > Fabrication Technologies
,
Electrical > Electronics & Semiconductors > Waferscale Computing