Search Results - waferscale+processors

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Universal Linear Intensity Transformations Using Spatially-Incoherent Diffractive Processors (Case No. 2023-192)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel platform technology to facilitate the design of all-optical visual processors, which can be used to perform advanced computational tasks at the speed of light. Background: Information processing via light is a cutting-edge field among optics...

Published: 4/5/2024 | Inventor(s): Aydogan Ozcan, MD Sadman Rahman, Xilin Yang

Keywords(s): Adaptive Optics, Algorithm Optical Coherence Tomography, all-optical diffractive computing, all-optical transformation, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, Atomic Force Microscopy Optical Tweezers, computational imaging, deep diffractive network, Deep Learning, Deep learning-based sensing, diffractive processor, Dispersion (Optics), Electron Microscope, Electro-Optics, fluorescence microscopy, Focus (Optics), Infrared Electromagnetic Spectrum Dispersion (Optics), interference processor, large language model (LLNMs), linear optics, linear transformations, Machine Learning, Microscope, Microscopy, Microscopy And Imaging, Near-Field Scanning Optical Microscope, neural networks, Nonlinear Optics, non-linear optics, Optical Coherence , Optical Communication , Optical computing, Optical Fiber Copper Wire And Cable, optical implementation, Optical Microscope, Optical networks, optical processor, optical transmission, Optics Parabolic Reflector Curved Mirror, phase-only diffractive network, reverse engineered optical system, Software, Software & Algorithms, Software Development Tools, spatially-incoherent light, start to end optics design, Surgical Instrument Optical Coherence Tomography, three dimensional imaging, visual computing, Waferscale Processors

Category(s): Optics & Photonics, Optics & Photonics > Microscopy, Platforms, Software & Algorithms > Image Processing, Electrical, Electrical > Signal Processing, Electrical > Computing Hardware

A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)

Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...

Published: 2/16/2024 | Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren

Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation