Search Results - semiconductor+chip+foundries

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Pulsed Dynamic Load Modulation Power Amplifier Circuit (Case No. 2006-330)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering developed a method for a power amplifier circuit with improved efficiency. Background: The wireless communication industry faces a demand for high data transfer rates with limited frequency resources. Existing methods of improving performance involve the use of power...

Published: 4/10/2024 | Inventor(s): Yuanxun Wang, Jinseong Jeong

Keywords(s): Antennas/Wireless, attenuator, Doping (Semiconductor), efficiency enhancement, Electronics & Semiconductors, energy-efficient wireless communication, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, power amplifier, Power Amplifier Circuit, pulsed load modulation, radiofrequency (RF) coil, radiofrequency signaling, RF signal, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, variable load matching, Wireless, wireless capsule endoscopy, wireless communication, Wireless Sensor Network, zzsemiconducting materials

Category(s): Electrical, Electrical > Signal Processing, Electrical > Wireless, Electrical > Electronics & Semiconductors

A Chemical-Dedoping Strategy to Tailor Electron Density in Molecular-Intercalated Bulk Monolayer MOS2 (Case No. 2024-022)

Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel strategy to decouple the interlayer interactions in bulk MoS2 to produce a bulk material with desirable monolayer properties. Background: Molybdenum disulfide (MoS2) is a popular and well-studied 2D semiconducting layered material. A single layer, or...

Published: 3/13/2024 | Inventor(s): Xiangfeng Duan, Yu Huang, Boxuan Zhou

Keywords(s): bulk material, bulk monolayer, chemical dedoping, direct bandgap, Doping (Semiconductor), Electronics & Semiconductors, exciton, indirect bandgap, intercalated materials, Microelectronics Semiconductor Device Fabrication, molybdenum disulfide (MOS2), monolayer, Optoelectronic materials, Organic Semiconductor, photoluminescence, photon absorption, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, spin polarization, valley polarization, zzsemiconducting materials

Category(s): Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors

A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)

Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...

Published: 2/16/2024 | Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren

Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation

Synaptic Circuits Made From Transistors and Memory Capacitors (UCLA Case No. 2023-092)

Summary: UCLA researchers from the Department of Mechanical and Aerospace Engineering have developed a novel circuit architecture that emulates neural synapses for concurrent parallel computing. Background: Almost all modern computer chips consist of computing and learning processes that are implemented sequentially. To improve computing power,...

Published: 12/19/2023 | Inventor(s): Yong Chen, Zixuan Rong

Keywords(s): Application-Specific Integrated Circuit, Artifical Intelligence (Machine Learning, Data Mining), artificial electromagnetic materials, Artificial Intelligence, artificial intelligence augmentation, Artificial Neural Network, Artificial Neural Network Artificial Neuron, artificial-intelligent materials, autonomous control, computational efficiency, edge computing, Electronics & Semiconductors, Energy Efficiency, energy management, Integrated Circuit, Medical artificial intelligence (AI), Neuromorphic circuits, parallel processing, parallel signal processing, processor design, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductors, synaptic resistor (synstor)

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials, Materials > Semiconducting Materials, Software & Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning