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2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs

Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer, Haoxiang Ren, Saptadeep Pal

Keywords(s): Amorphous Silicon, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, Artificial Neural Network, Bandwidth (Signal Processing), Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Clock Signal, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Machine Learning, Machine Vision, Manufacturing, Microelectronics Semiconductor Device Fabrication, Microprocessor, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Supercomputer, System On A Chip, Tablet Computer

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Circuits, Software & Algorithms > Artificial Intelligence & Machine Learning

2022-051 Reliable and Fault-Tolerant Clock Generation and Distribution for Chiplet-Based Waferscale Processors

Summary: UCLA researchers in the department of Electrical and Computer Engineering have developed an on-chip clock propagation circuit that allows creation of large-scale fault-robust processor systems which are essential for the next generation of big data solutions. Background: Waferscale processor systems can provide the large number of cores,...

Published: 12/12/2023 | Inventor(s): Puneet Gupta, Saptadeep Pal

Keywords(s): Chipset, Clock Signal, Computer Architecture, Electrical Breakdown, Electronics & Semiconductors, Integrated Circuit, Microprocessor, Network On A Chip, Semiconductor, Semiconductor Device, Semiconductors, Supercomputer, System On A Chip

Category(s): Electrical > Electronics & Semiconductors, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors > Circuits

2021-212 Configurable Memory Pool System

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a node processing architecture that allows memory pool to be scalable and allows the integration of heterogeneous technologies downstream. Background: Modern electronic applications require high memory capacity and bandwidth. However, many of these applications...

Published: 12/22/2023 | Inventor(s): Puneet Gupta, Saptadeep Pal, Matthew Tomei, Rakesh Kumar

Keywords(s): Bandwidth (Computing), Dynamic Random-Access Memory, Electrical Engineering, Flash Memory, Latency (Engineering), Magnetoresistive Random-Access Memory, Random-Access Memory, Static Random-Access Memory

Category(s): Electrical, Electrical > Electronics & Semiconductors > Circuits, Electrical > Electronics & Semiconductors

2020-391 Methods for Carrying Out Micromechanical Logic Operations

SUMMARYProfessor Hopkins and colleagues have developed a micromechanical displacement-based logic circuit system that can detect changes in its environment over an extended period of time without external power. The system is small enough to be indiscernible when attached to an object and can be tuned to respond to changes in temperature, pressure or...

Published: 7/19/2023 | Inventor(s): Jonathan Hopkins

Keywords(s):

Category(s): Electrical > Sensors, Mechanical > Sensors, Electrical > Electronics & Semiconductors > Circuits

2020-868 Flexible Inorganic MicroLED Displays Using Fan-Out Wafer-Level Packaging

SUMMARYUCLA researchers in the Department of Electrical and Computer Engineering have developed an efficient and low-cost method to integrate inorganic light emitting diodes into rubber-like substrates that are transparent, flexible and biocompatible. BACKGROUNDThere is a growing demand for modular and flexible light emitting displays for applications...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer

Keywords(s):

Category(s): Electrical > Displays, Electrical > Electronics & Semiconductors > Circuits, Electrical > Electronics & Semiconductors

2020-861 Superconducting Silicon Interconnect Fabric (Superconducting-IF)

SUMMARYUCLA researchers in the Department of Electrical and Computer Engineering have developed a platform that can control heterogeneous integration of dies with 10 μm interconnect pitches and extends the fabrication of Silicon Interconnect Fabric (Si-IF) into the cryogenic and superconducting temperature ranges.BACKGROUNDQuantum computing is an...

Published: 7/19/2023 | Inventor(s): Yu-Tao Yang, Subramanian Iyer

Keywords(s):

Category(s): Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits

2017-977 Load-Induced Frequency-Shift-Keying: A New Modulation Scheme That Enables Simultaneous Near-Field Wireless Power And Data Transmission Through A Single Set of Inductive Coils

SUMMARYUCLA researchers in the Department of Electrical Engineering have developed the first modulation system that allows simultaneous wireless power and data transmission through a single pair of inductive coils.BACKGROUNDNext-generation Brain-Machine Interface senses neural data and stimulates the brain when needed, which requires simultaneous external...

Published: 7/19/2023 | Inventor(s): Asad Abidi, Dejan Markovic, Jiacheng Pan

Keywords(s): Antennas/Wireless, Cns, Electronics & Semiconductors, Medical Devices and Materials, Monitoring And Recording Systems, Psychiatry / Mental Health

Category(s): Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits, Electrical > Quantum Computing, Medical Devices, Medical Devices > Monitoring And Recording Systems, Therapeutics > CNS and Neurology, Therapeutics > Psychiatry And Mental Health, Electrical > Wireless

On-Chip Electrostatic Discharge Sensor

UC Case No. 2019-702SUMMARYResearchers in the UCLA Department of Electric and Computer Engineering have designed a new on-chip sensor to prevent electrostatic discharge, which would largely enhance the life and durability of integrated circuits.BACKGROUNDElectrostatic discharge (ESD) in integrated circuits (IC) occurs due to electrostatic charge transfer...

Published: 7/19/2023 | Inventor(s):

Keywords(s):

Category(s): Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits

Pulsed-Coherent Electronic Front End for Detection and Ranging

UC Case No. 2020-109 SUMMARY: Researchers in the UCLA Department of Electrical and Computer Engineering have developed a Light Detection and Ranging (LiDAR) device capable of high resolution, high acquisition measurements with minimized walk error and adjustable detection quality. BACKGROUND: Demand for ranging systems with high depth resolution...

Published: 7/19/2023 | Inventor(s): Chih Kong Yang, Liyang Chen

Keywords(s): Electronics & Semiconductors

Category(s): Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits, Materials > Fabrication Technologies

2019-489 SYNCHRONIZED DICAD SWITCHING FOR FMCW RADAR RESOLUTION ENHANCEMENT

Synchronized DiCAD Switching for FMCW Radar Resolution EnhancementUC Case 2019-489SUMMARY:UCLA researchers in the Department of Electrical and Computer Engineering have developed a frequency-modulated continuous wave radar system that extends chirp bandwidth, leading to higher axial radar resolutions.BACKGROUND:There is an increasing demand for simple,...

Published: 7/19/2023 | Inventor(s):

Keywords(s): Electronics & Semiconductors, Optics, Photonics, Sensors

Category(s): Electrical > Electronics & Semiconductors, Electrical > Sensors, Electrical > Electronics & Semiconductors > Circuits, Optics & Photonics

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