Search Results - analogue+electronics

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Carrier Storage Frequency Divider Using Silicon PIN Diodes (Case No. 2025-023)

Summary: Researchers in UCLA’s Department of Electrical and Computer Engineering have designed and fabricated an innovative device capable of frequency division at the Terahertz range, featuring low power consumption, quadrature outputs, and high sensitivity. Background: Traditional electronic and optical devices struggle to operate at the...

Published: 2/14/2025 | Inventor(s): Sidharth Thomas, Aydin Babakhani, Benyamin Fallahi Motlagh

Keywords(s): Analogue Electronics, Antennas/Wireless, artificial electromagnetic materials, Bandwidth (Signal Processing), Bioelectromagnetics, bioelectronics, bistable electroactive polymer, Cardiac Electrophysiology, Consumer Electronics, Continuous-Wave Radar, Digital Electronics, Digital Signal Processing, Electrical Engineering, Electroactive Polymers, Electrocatalyst, electrochemical sensors, Electrode, Electrode 3D Printing, electrodeposition, electrodes, Electroencephalography, Electroencephalography (EEG), Electroencephalography Microsecond Neurofeedback, Electrolyte, electromagnetic, Electromagnetism, Electron, electron emittance, Electron Gun, Electronics & Semiconductors, energy-efficient wireless communication, Extremely High Frequency, high-frequency signals, image signal processing, Imaging, Integrated Circuit, low-power device, Optical networks, PIN Diode, power conversion efficiency, Radar, Radar / Antennae, Remote Sensing, Semiconductor, Semiconductor Device, Semiconductors, signal decoding, Signal Processing, Silicon, Synthetic aperture radar (SAR), Wireless, wireless communication, wireless connectivity, Wireless Sensor Network, wireless spectrum

Category(s): Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits, Electrical, Electrical > Wireless, Electrical > Signal Processing

2021-229 Processes, Equipment and Materials Recipes, and Related Know-How to Perform the Silicon-Interconnect Fabric (Si-IF) Chip-Scale Packaging Technology

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel manufacturing process for Silicone-Interconnect Fabric (Si-IF) that is not only scalable, but also robust as it relies on established processing techniques from CMOS technologies. Background: With the rise of computation-heavy applications, such...

Published: 2/14/2025 | Inventor(s): Subramanian Iyer

Keywords(s): Analogue Electronics, CMOS, Consumer Electronics, Digital Electronics, Electronic Packaging, Electronics & Semiconductors, electronics packaging, heterogenous electronic systems, Integrated Circuit Via (Electronics), Interposers, Nanotechnology, Power Electronics, Printed Circuit Board, Printed Electronics, Silicon

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Nanotechnology, Electrical > Electronics & Semiconductors > Memory

2021-400 COMET: On-Die and In-Controller Collaborative Memory ECC Technique for Stronger and Safer Correction of DRAM Errors

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a method titled Collaborative Memory ECC Technique (COMET), to efficiently detect two error correcting codes (ECC) and eliminate silent data corruption (SDC) when double-bit errors occur within DRAMs. Background: Technological abundance has been the...

Published: 2/14/2025 | Inventor(s): Puneet Gupta, Irina Alam

Keywords(s): Analogue Electronics, Big Data, Data Corruption, DDR3 SDRAM, DDR4 SDRAM, Random-Access Memory, Semiconductor, Semiconductor Device, Soft Error, Software

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials > Semiconducting Materials, Energy & Environment > Energy Storage