Search Results - manufacturing

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2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs

Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer, Haoxiang Ren, Saptadeep Pal

Keywords(s): Amorphous Silicon, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, Artificial Neural Network, Bandwidth (Signal Processing), Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Clock Signal, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Machine Learning, Machine Vision, Manufacturing, Microelectronics Semiconductor Device Fabrication, Microprocessor, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Supercomputer, System On A Chip, Tablet Computer

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Circuits, Software & Algorithms > Artificial Intelligence & Machine Learning

Room-Temperature Annealing-Free Metal Printing Technique via Anion-Assisted Photochemical Desposition (UCLA Case No. 2022-266)

Summary: UCLA researchers in the Department of Materials Science and Engineering have developed an innovative metal patterning fabrication technique that produces highly conductive metallic patterns at room temperature on a broad range of substrate materials. Background: Photo-lithographic techniques for metal patterning have enabled incredible advancements...

Published: 7/19/2023 | Inventor(s): Ximin He, Dong Wu

Keywords(s): Electronics & Semiconductors, Manufacturing, Materials, MEMS, Metals, Semiconductor, Semiconductor Device, Semiconductors

Category(s): Materials, Materials > Metals, Mechanical, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors, Mechanical > Micro-Electromechanical Systems (Mems)

2013-467 Inspecting Method and Inspecting Apparatus

SUMMARY: UCLA researchers in the Department of Electrical and Computer Engineering have developed a method that utilizes a hybrid dispersion laser scanner for fast quality control of particles on silicon wafers to reduce wafer manufacturing cost. BACKGROUND: Web inspection, also known as surface inspection, is a method widely used for evaluation...

Published: 10/9/2024 | Inventor(s): Bahram Jalali, Keisuke Goda, Masahiro Watanabe, Toshiyuki Nakao, Yasuhiro Yoshitake

Keywords(s): Dispersion (Optics), Laser, Lens (Optics), Liquid-Crystal Display, Manufacturing, Optics, Quality Control, Sensors, Silicon, Surface Conductivity

Category(s): Electrical > Sensors, Electrical, Electrical > Displays, Electrical > Instrumentation, Optics & Photonics

2007-405 Massively Parallel Assembly of Composite Structures using Depletion Attractions

Summary: Scientists in the Department of Chemistry and Biochemistry at UCLA have identified a way to selectively order and assemble solid microcomponents dispersed in liquids into larger composite devices using attractive interactions that are geometry-dependent. This technique enables the systematic parallel fabrication of complex microstructures...

Published: 7/19/2023 | Inventor(s): Thomas Mason

Keywords(s): Composite Material, Composite Materials, Lithography, Manufacturing, MEMS, Microelectronics, Microelectronics Semiconductor Device Fabrication, Nanotechnology

Category(s): Materials > Composite Materials, Materials, Materials > Nanotechnology, Mechanical, Electrical > Mems