Search Results - semiconductor+device

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Diamond Needle Insertion Technique for High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...

Published: 2/20/2026 | Inventor(s): Tiwei Wei

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)

Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors

Through-Glass Vias (TGVS) Thermal Management Using Diamond-Assisted Copper Metallization for Advanced 3DIC Packaging (Case No. 2026-156)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...

Published: 2/20/2026 | Inventor(s): Tiwei Wei, Ye Yang

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials

Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking

CDMA MIMO Readout Networks for Semiconductor-Based Compact 2-Dimensional Qubit Array (Case No. 2025-153)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel CDMA-MIMO qubit readout network that enables scalable, high-fidelity measurement of two-dimensional semiconductor qubit arrays for fault-tolerant quantum computing. Background: Qubit arrays form the foundation of complex quantum computations...

Published: 12/12/2025 | Inventor(s): Mau-Chung Chang, Jhih-Wei Chen

Keywords(s): computational efficiency, computational efficiency and analysis, Electrical, Electrical Engineering, Electronics & Semiconductors, large-area arrays, quantum communication, Quantum Computer, quantum error correction (QEC), quantum network, quantum processing, quantum processor, Semiconductor, Semiconductor Device, Semiconductors

Category(s): Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Electrical > Quantum Computing, Software & Algorithms > Communication & Networking, Software & Algorithms

Method for Reducing Process Variation-Induced Threshold Voltage Mismatch in FD-SOI Transistors (Case No. 2025-271)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a transistor-level method that dynamically tunes device characteristics to eliminate mismatch, achieving higher stability and precision without added area or power costs. Background: Transistors are the fundamental semiconductor building blocks for amplification,...

Published: 10/23/2025 | Inventor(s): Subramanian Iyer, Siyun Qiao, Jacklyn Zhu, Samuel Wang

Keywords(s): device stability, Electronics & Semiconductors, frequency modulation, Integrated Circuit, Integrated Circuit Via (Electronics), Microelectronics Semiconductor Device Fabrication, Mixed-Signal Integrated Circuit, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, Signal Processing, Silicon, Transistor, transistors

Category(s): Electrical, Electrical > Signal Processing, Electrical > Instrumentation, Electrical > Electronics & Semiconductors, Software & Algorithms, Software & Algorithms > Communication & Networking

Mechanical Cutaneous Nerve Stimulation for Reducing Epileptic Seizures and Perceived Pain (Case No. 2016-686-3)

Summary: UCLA researchers have developed a novel, non-invasive pain management device that uses mechanical vibrations to activate cutaneous sensory fibers, reducing epileptic seizures, masking pain perception and alleviating associated symptoms. Background: Unexpected death due to epilepsy is a pressing concern, with an estimated incidence of 1.2...

Published: 7/29/2025 | Inventor(s): Ronald Harper, Eberhardt Sauerland, Christopher Degiorgio

Keywords(s): low-power device, Medical Device, Medical Devices and Materials, minimally invasive device, Neuropathology, Neurostimulation, non-invasive, Pain Treatment, sample-to-answer devices, Semiconductor Device, Smart medical device, Stroke, Transcutaneous Electrical Nerve Stimulation, Vibration monitoring, Vibration sensing, wearable medical device, wearable medical devices

Category(s): Medical Devices, Medical Devices > Monitoring And Recording Systems, Medical Devices > Neural Stimulation, Medical Devices > Hospital Systems, Therapeutics, Therapeutics > CNS and Neurology

Carrier Storage Frequency Divider Using Silicon PIN Diodes (Case No. 2025-023)

Summary: Researchers in UCLA’s Department of Electrical and Computer Engineering have designed and fabricated an innovative device capable of frequency division at the Terahertz range, featuring low power consumption, quadrature outputs, and high sensitivity. Background: Traditional electronic and optical devices struggle to operate at the...

Published: 12/8/2025 | Inventor(s): Sidharth Thomas, Aydin Babakhani, Benyamin Fallahi Motlagh

Keywords(s): Analogue Electronics, Antennas/Wireless, artificial electromagnetic materials, Bandwidth (Signal Processing), Bioelectromagnetics, bioelectronics, bistable electroactive polymer, Cardiac Electrophysiology, Consumer Electronics, Continuous-Wave Radar, Digital Electronics, Digital Signal Processing, Electrical Engineering, Electroactive Polymers, Electrocatalyst, electrochemical sensors, Electrode, Electrode 3D Printing, electrodeposition, electrodes, Electroencephalography, Electroencephalography (EEG), Electroencephalography Microsecond Neurofeedback, Electrolyte, electromagnetic, Electromagnetism, Electron, electron emittance, Electron Gun, Electronics & Semiconductors, energy-efficient wireless communication, Extremely High Frequency, high-frequency signals, image signal processing, Imaging, Integrated Circuit, low-power device, Optical networks, PIN Diode, power conversion efficiency, Radar, Radar / Antennae, Remote Sensing, Semiconductor, Semiconductor Device, Semiconductors, signal decoding, Signal Processing, Silicon, Synthetic aperture radar (SAR), Wireless, wireless communication, wireless connectivity, Wireless Sensor Network, wireless spectrum

Category(s): Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits, Electrical, Electrical > Wireless, Electrical > Signal Processing

Electrically Gated Solid-State Molecular Thermal Transistor (Case No. 2024-099)

Summary: UCLA researchers have introduced a solid-state thermal transistor that achieves groundbreaking performance and facilitates improved heat flow manipulation. Background: The forefront of thermal management is marked by the exploration of molecular thermal transistors, driven by the quest for more efficient electronic devices. Researchers are...

Published: 2/14/2025 | Inventor(s): Yongjie Hu, Paul Weiss, Man Li

Keywords(s): ; self-assembled molecule, Composite Material, Doping (Semiconductor), Elastic Modulus Thermal Grease, Electronics & Semiconductors, field-effect transistors (FETs), Functional Materials, heat control, heat controlling devices, infrared thermal imaging, Microelectronics Semiconductor Device Fabrication, molecular design, molecular engineering, molecular junction, Nanomaterials, Optoelectronic materials, Optomechanical Thermal Imaging Transducer, organic field effect transistors, Organic Semiconductor, phase change materials, Rechargeable Battery Thermal Conductivity, self-assembled molecule, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, solid-state thermal transistor, strength-thermal stability, switching reversibility, thermal circuit, thermal compression bonding, thermal conductance, Thermal Energy Storage, thermal fusion, thermal imaging, thermal management systems, thermal stability, thermal switching speed, thermal switching speeds, thermal transistor, Thin-Film Transistor, Transistor, transistors, zzsemiconducting materials

Category(s): Electrical, Electrical > Electronics & Semiconductors, Energy & Environment, Energy & Environment > Energy Generation, Energy & Environment > Energy Storage, Energy & Environment > Energy Transmission, Energy & Environment > Thermal, Electrical > Instrumentation, Materials, Materials > Nanotechnology

Pulsed Dynamic Load Modulation Power Amplifier Circuit (Case No. 2006-330)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering developed a method for a power amplifier circuit with improved efficiency. Background: The wireless communication industry faces a demand for high data transfer rates with limited frequency resources. Existing methods of improving performance involve the use of power...

Published: 7/17/2025 | Inventor(s): Yuanxun Wang, Jinseong Jeong

Keywords(s): Antennas/Wireless, attenuator, Doping (Semiconductor), efficiency enhancement, Electronics & Semiconductors, energy-efficient wireless communication, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, power amplifier, Power Amplifier Circuit, pulsed load modulation, radiofrequency (RF) coil, radiofrequency signaling, RF signal, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, variable load matching, Wireless, wireless capsule endoscopy, wireless communication, Wireless Sensor Network, zzsemiconducting materials

Category(s): Electrical, Electrical > Signal Processing, Electrical > Wireless, Electrical > Electronics & Semiconductors

A Chemical-Dedoping Strategy to Tailor Electron Density in Molecular-Intercalated Bulk Monolayer MOS2 (Case No. 2024-022)

Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel strategy to decouple the interlayer interactions in bulk MoS2 to produce a bulk material with desirable monolayer properties. Background: Molybdenum disulfide (MoS2) is a popular and well-studied 2D semiconducting layered material. A single layer, or...

Published: 2/14/2025 | Inventor(s): Xiangfeng Duan, Yu Huang, Boxuan Zhou

Keywords(s): bulk material, bulk monolayer, chemical dedoping, direct bandgap, Doping (Semiconductor), Electronics & Semiconductors, exciton, indirect bandgap, intercalated materials, Microelectronics Semiconductor Device Fabrication, molybdenum disulfide (MOS2), monolayer, Optoelectronic materials, Organic Semiconductor, photoluminescence, photon absorption, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, spin polarization, valley polarization, zzsemiconducting materials

Category(s): Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors

A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)

Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...

Published: 10/20/2025 | Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren

Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation

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