Search Results - microelectronics+semiconductor+device+fabrication

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Diamond Needle Insertion Technique for High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...

Published: 2/20/2026 | Inventor(s): Tiwei Wei

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)

Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors

Through-Glass Vias (TGVS) Thermal Management Using Diamond-Assisted Copper Metallization for Advanced 3DIC Packaging (Case No. 2026-156)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...

Published: 2/23/2026 | Inventor(s): Tiwei Wei, Ye Yang

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials

Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking

Method for Reducing Process Variation-Induced Threshold Voltage Mismatch in FD-SOI Transistors (Case No. 2025-271)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a transistor-level method that dynamically tunes device characteristics to eliminate mismatch, achieving higher stability and precision without added area or power costs. Background: Transistors are the fundamental semiconductor building blocks for amplification,...

Published: 10/23/2025 | Inventor(s): Subramanian Iyer, Siyun Qiao, Jacklyn Zhu, Samuel Wang

Keywords(s): device stability, Electronics & Semiconductors, frequency modulation, Integrated Circuit, Integrated Circuit Via (Electronics), Microelectronics Semiconductor Device Fabrication, Mixed-Signal Integrated Circuit, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, Signal Processing, Silicon, Transistor, transistors

Category(s): Electrical, Electrical > Signal Processing, Electrical > Instrumentation, Electrical > Electronics & Semiconductors, Software & Algorithms, Software & Algorithms > Communication & Networking

Liquid Metal Printing Technique via Optical Maskless Lithography (Case No. 2024-031)

Summary: Researchers in the UCLA Department of Materials Science and Engineering have developed a facile, rapid method to print soft, wearable electronics. Background: Soft electrical circuits have garnered significant interest in a broad range of emerging technologies, including wearable electronics, brain-machine interfaces, and soft robotics....

Published: 3/6/2025 | Inventor(s): Ximin He, Dong Wu

Keywords(s): Coating, Coatings, Adhesives, & Inks, Electronics & Semiconductors, Fabrication Technologies, gallium-based liquid metals, General Device Coatings, Liquid metal particles, liquid metals, Metals, Microelectronics Semiconductor Device Fabrication, Polymer, Polymers, scalable fabrication, Semiconductor Device Fabrication, soft electrical circuits, soft electronics, wearable electronics, wearable sensors

Category(s): Chemical, Chemical > Polymers, Chemical > Coatings, Adhesives & Inks, Electrical, Electrical > Electronics & Semiconductors, Electrical > Sensors, Electrical > Instrumentation, Electrical > Flexible Electronics, Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Materials > Metals

Electrically Gated Solid-State Molecular Thermal Transistor (Case No. 2024-099)

Summary: UCLA researchers have introduced a solid-state thermal transistor that achieves groundbreaking performance and facilitates improved heat flow manipulation. Background: The forefront of thermal management is marked by the exploration of molecular thermal transistors, driven by the quest for more efficient electronic devices. Researchers are...

Published: 2/14/2025 | Inventor(s): Yongjie Hu, Paul Weiss, Man Li

Keywords(s): ; self-assembled molecule, Composite Material, Doping (Semiconductor), Elastic Modulus Thermal Grease, Electronics & Semiconductors, field-effect transistors (FETs), Functional Materials, heat control, heat controlling devices, infrared thermal imaging, Microelectronics Semiconductor Device Fabrication, molecular design, molecular engineering, molecular junction, Nanomaterials, Optoelectronic materials, Optomechanical Thermal Imaging Transducer, organic field effect transistors, Organic Semiconductor, phase change materials, Rechargeable Battery Thermal Conductivity, self-assembled molecule, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, solid-state thermal transistor, strength-thermal stability, switching reversibility, thermal circuit, thermal compression bonding, thermal conductance, Thermal Energy Storage, thermal fusion, thermal imaging, thermal management systems, thermal stability, thermal switching speed, thermal switching speeds, thermal transistor, Thin-Film Transistor, Transistor, transistors, zzsemiconducting materials

Category(s): Electrical, Electrical > Electronics & Semiconductors, Energy & Environment, Energy & Environment > Energy Generation, Energy & Environment > Energy Storage, Energy & Environment > Energy Transmission, Energy & Environment > Thermal, Electrical > Instrumentation, Materials, Materials > Nanotechnology

Pulsed Dynamic Load Modulation Power Amplifier Circuit (Case No. 2006-330)

Summary: UCLA researchers in the Department of Electrical and Computer Engineering developed a method for a power amplifier circuit with improved efficiency. Background: The wireless communication industry faces a demand for high data transfer rates with limited frequency resources. Existing methods of improving performance involve the use of power...

Published: 7/17/2025 | Inventor(s): Yuanxun Wang, Jinseong Jeong

Keywords(s): Antennas/Wireless, attenuator, Doping (Semiconductor), efficiency enhancement, Electronics & Semiconductors, energy-efficient wireless communication, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, power amplifier, Power Amplifier Circuit, pulsed load modulation, radiofrequency (RF) coil, radiofrequency signaling, RF signal, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, variable load matching, Wireless, wireless capsule endoscopy, wireless communication, Wireless Sensor Network, zzsemiconducting materials

Category(s): Electrical, Electrical > Signal Processing, Electrical > Wireless, Electrical > Electronics & Semiconductors

A Chemical-Dedoping Strategy to Tailor Electron Density in Molecular-Intercalated Bulk Monolayer MOS2 (Case No. 2024-022)

Summary: UCLA researchers in the Department of Chemistry & Biochemistry have developed a novel strategy to decouple the interlayer interactions in bulk MoS2 to produce a bulk material with desirable monolayer properties. Background: Molybdenum disulfide (MoS2) is a popular and well-studied 2D semiconducting layered material. A single layer, or...

Published: 2/14/2025 | Inventor(s): Xiangfeng Duan, Yu Huang, Boxuan Zhou

Keywords(s): bulk material, bulk monolayer, chemical dedoping, direct bandgap, Doping (Semiconductor), Electronics & Semiconductors, exciton, indirect bandgap, intercalated materials, Microelectronics Semiconductor Device Fabrication, molybdenum disulfide (MOS2), monolayer, Optoelectronic materials, Organic Semiconductor, photoluminescence, photon absorption, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, spin polarization, valley polarization, zzsemiconducting materials

Category(s): Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors

A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)

Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...

Published: 10/20/2025 | Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren

Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation

2022-109 Methods and Apparatus for Intercoupled THz Radiating Arrays

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have designed a novel intercoupled oscillator array architecture for efficient THz generation. Background: Efficient THz generation in silicon technologies has been of great interest over the recent years, as it enables an integrated low-cost solution for sensing,...

Published: 7/17/2025 | Inventor(s): Aydin Babakhani, Seyedmohammadreza Razavian

Keywords(s): Active Antenna, Antenna (Radio), Antenna (Radio) Flip Chip DisplayPort, Antennas/Wireless, Application-Specific Integrated Circuit, Communication & Networking, Continuous Wave, Continuous-Wave Radar, Diode, Doping (Semiconductor), Elastomer Static Pressure Pulse Wave, Electronics & Semiconductors, Frequency conversion, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), Laser Diode, Light-Emitting Diode, Light-Emitting Diode Monochrome Inkjet Printing, Microelectronics Semiconductor Device Fabrication, Microstrip Antenna, Microwave, Microwave Base Transceiver Station, Microwave Microwave Video Scaler, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, Network Analysis (Electrical Circuits), Optoelectronics Waveguide (Electromagnetism), Organic Semiconductor, Patch Antenna, Patch Antenna Mobile Phone, Phase (Waves), Photodiode, Photonic Integrated Circuit, PIN Diode, Printed Circuit Board, Radar / Antennae, Radio Frequency Sine Wave, Radiodensity, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, Smart Antenna, Standing Wave, Telecommunication, Three-Dimensional Integrated Circuit, Waveform, Waveguide, Waveguide (Electromagnetism), Waveguide Light, Waveguide Waveguide (Electromagnetism), Wavelength, zzsemiconducting materials

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials > Semiconducting Materials, Electrical > Wireless

2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs

Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...

Published: 7/17/2025 | Inventor(s): Subramanian Iyer, Haoxiang Ren, Saptadeep Pal

Keywords(s): Amorphous Silicon, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, Artificial Neural Network, Bandwidth (Signal Processing), Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Clock Signal, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Machine Learning, Machine Vision, Manufacturing, Microelectronics Semiconductor Device Fabrication, Microprocessor, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Supercomputer, System On A Chip, Tablet Computer

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Circuits, Software & Algorithms > Artificial Intelligence & Machine Learning

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