Search Results - chipset

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Batteryless, Chipless Millimeterwave RFID Tags (UCLA Case No. 2023-220)
Intro Sentence: UCLA researchers in the Department of Computer Science have developed a chipless and batteryless RFID tag that operates at mmWave frequency and achieves millimeter resolution. Background: Radio frequency identification (RFID) tags have been used for a wide range of applications, such as baggage tracking and item localization in warehouses....
Published: 2/28/2024   |   Inventor(s): Omid Abari, Mohammadreza Pakdeh, Mohammad Hossein Mazaheri Kalahrody
Keywords(s): - Agriculture, Antenna (Radio) Flip Chip DisplayPort, Antennas/Wireless, Chipset, Electronics & Semiconductors, Internet of Things (IoT), Inventory, Inventory Management, Logistics, Millimeterwave network, real-time sensing/monitoring/tracking, RFID, RFID (Radio Frequency Identification), Semiconductor, Semiconductors, Wireless
Category(s): Electrical, Electrical > Wireless > Antennas, Electrical > Wireless, Electrical > Electronics & Semiconductors, Electrical > Sensors
2014-9AG Wide-Field Computational Imaging of Pathology Slides Using Lensfree On-Chip Microscopy
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a wide field-of-view (FOV) computational imaging method using lens-free on-chip microscopy to efficiently and cost-effectively scan biological samples such as pathology slides. Background: Wide field-of-view (FOV) and high-resolution imaging is crucial...
Published: 7/19/2023   |   Inventor(s): Aydogan Ozcan, Alon Greenbaum, Yibo Zhang, Alborz Feizi, Wei Luo
Keywords(s): 4Pi Microscope, Adaptive Optics, Animal Imaging, Antenna (Radio) Flip Chip DisplayPort, Artificial Intelligence, Atomic Force Microscopy, Atomic Force Microscopy Insulator (Electricity), Atomic Force Microscopy Optical Tweezers, Bright Field Microscopy, Cardiac Magnetic Resonance Imaging, Cell Counting/Imaging, Chipset, Confocal Microscopy, Cytopathology, Dark Field Microscopy, Dispersion (Optics), Electron Microscope, Electro-Optics, Fluorescence Microscope, Fluorescence-Lifetime Imaging Microscopy Leading Lights, Focus (Optics), Functional Magnetic Resonance Imaging, Histopathology, Hyperspectral Imaging, Imaging, Infrared Electromagnetic Spectrum Dispersion (Optics), Lab-On-A-Chip, Lens (Optics), Magnetic Resonance Imaging, Magnetic Resonance Imaging Carotid Artery Stenosis, Magnetic Resonance Imaging Hypoxia (Medical), Magnetic Resonance Imaging Medical Physics, Magnetic Resonance Imaging Microangiopathy, Magnetic Resonance Imaging Pathology, Magnetic Resonance Imaging Spin Polarization, Magnetic Resonance Imaging Unmanned Aerial Vehicle, Medical Imaging, Medical Imaging Eyepiece, Microscale Chemistry, Microscope, Microscopy, Microscopy And Imaging, Molecular Imaging, Molecular Imaging Physics Of Magnetic Resonance Imaging, Molecular Imaging Ylide, Near-Field Scanning Optical Microscope, Network On A Chip, Neuroimaging, Neuropathology, Nonlinear Optics, Nonlinear Optics Molecular Dynamics, Optical Microscope, Optics, Optics Parabolic Reflector Curved Mirror, Phase-Contrast Imaging, Phase-Contrast Imaging Genomics, Prism (Optics), Scanning Probe Microscopy, Scanning Tunneling Microscope, Serial Time-Encoded Amplified Microscopy, STED Microscopy, Stereo Microscope, Super Resolution Microscopy, System On A Chip, Transmission Electron Microscopy
Category(s): Life Science Research Tools, Electrical, Electrical > Imaging, Life Science Research Tools > Microscopy And Imaging, Software & Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning, Diagnostic Markers, Diagnostic Markers > Targets And Assays, Medical Devices > Medical Imaging
2022-241 A TSV-Less Architecture for Power Delivery and I/O for Interposers and Other Advanced Packaging Constructs
Summary: UCLA researchers led by Professor Iyer have developed a wafer-scale processor manufacturing method that does not require standard through-silicon vias (TSVs). Background: With the rise of machine learning applications, demand for devices capable of high-performance computing (HPC) has also increased. Popularity and demand for wafer-scale...
Published: 7/19/2023   |   Inventor(s): Subramanian Iyer, Haoxiang Ren, Saptadeep Pal
Keywords(s): Amorphous Silicon, Artifical Intelligence (Machine Learning, Data Mining), Artificial Intelligence, Artificial Neural Network, Bandwidth (Signal Processing), Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Clock Signal, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Machine Learning, Machine Vision, Manufacturing, Microelectronics Semiconductor Device Fabrication, Microprocessor, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Supercomputer, System On A Chip, Tablet Computer
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Electrical > Electronics & Semiconductors > Circuits, Software & Algorithms > Artificial Intelligence & Machine Learning
Silicon Interconnect Fabric (Si-IF) Technologies - Subramanian Iyer
Background: Over the past two decades, silicon chips have decreased in size by 1000x, while packages on circuit boards have only shrunk by 4x. This will eventually limit scaling of integrated circuits and subsequent processor performance. A solution is the invention of platforms for packageless integration of heterogeneous dies, such as silicon interconnect...
Published: 7/19/2023   |   Inventor(s): Subramanian Iyer
Keywords(s): Amorphous Silicon, Antenna (Radio) Flip Chip DisplayPort, Application-Specific Integrated Circuit, Bandwidth (Signal Processing), Bandwidth (Signal Processing) RF Transmitters, Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Brain Stimulation, Electrical Breakdown, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Load Equation Of State, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Enzyme Substrate (Biology), Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Image Processing, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), Lab-On-A-Chip, Microelectronics Semiconductor Device Fabrication, Microprocessor, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Photonic Integrated Circuit, Printed Circuit Board, Process Optimization, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Substrate (Chemistry), Supercomputer, System On A Chip, Tablet Computer, Three-Dimensional Integrated Circuit, Transcutaneous Electrical Nerve Stimulation, zzsemiconducting materials
Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Semiconducting Materials, Medical Devices, Medical Devices > Coatings
Waferscale Computing, Emerging Memory Systems, and Lightweight Machine Learning Systems - Puneet Gupta
2022-051 Reliable and Fault-Tolerant Clock Generation and Distribution for Chiplet-Based Waferscale Processors Researchers at UCLA have developed an on-chip fast clock which can be integrated into each chiplet. By doing this, the fast clock can be propagated from one chiplet to another. This provides consistent clock signaling to large systems as well...
Published: 7/19/2023   |   Inventor(s): Puneet Gupta
Keywords(s): Artificial Intelligence, Chipset, DDR4 SDRAM, Electrical Engineering, Electronics & Semiconductors, Semiconductor, Semiconductor Device, Semiconductors, Software, Software & Algorithms
Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Signal Processing, Materials > Semiconducting Materials, Software & Algorithms > Artificial Intelligence & Machine Learning, Electrical > Electronics & Semiconductors > Memory
2022-051 Reliable and Fault-Tolerant Clock Generation and Distribution for Chiplet-Based Waferscale Processors
Summary: UCLA researchers in the department of Electrical and Computer Engineering have developed an on-chip clock propagation circuit that allows creation of large-scale fault-robust processor systems which are essential for the next generation of big data solutions. Background: Waferscale processor systems can provide the large number of cores,...
Published: 12/12/2023   |   Inventor(s): Puneet Gupta, Saptadeep Pal
Keywords(s): Chipset, Clock Signal, Computer Architecture, Electrical Breakdown, Electronics & Semiconductors, Integrated Circuit, Microprocessor, Network On A Chip, Semiconductor, Semiconductor Device, Semiconductors, Supercomputer, System On A Chip
Category(s): Electrical > Electronics & Semiconductors, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors > Circuits
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