Search Results - thermal+compression+bonding

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Electrically Gated Solid-State Molecular Thermal Transistor (Case No. 2024-099)

Summary: UCLA researchers have introduced a solid-state thermal transistor that achieves groundbreaking performance and facilitates improved heat flow manipulation. Background: The forefront of thermal management is marked by the exploration of molecular thermal transistors, driven by the quest for more efficient electronic devices. Researchers are...

Published: 10/23/2024 | Inventor(s): Yongjie Hu, Paul Weiss, Man Li

Keywords(s): ; self-assembled molecule, Composite Material, Doping (Semiconductor), Elastic Modulus Thermal Grease, Electronics & Semiconductors, field-effect transistors (FETs), Functional Materials, heat control, heat controlling devices, infrared thermal imaging, Microelectronics Semiconductor Device Fabrication, molecular design, molecular engineering, molecular junction, Nanomaterials, Optoelectronic materials, Optomechanical Thermal Imaging Transducer, organic field effect transistors, Organic Semiconductor, phase change materials, Rechargeable Battery Thermal Conductivity, self-assembled molecule, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, solid-state thermal transistor, strength-thermal stability, switching reversibility, thermal circuit, thermal compression bonding, thermal conductance, Thermal Energy Storage, thermal fusion, thermal imaging, thermal management systems, thermal stability, thermal switching speed, thermal switching speeds, thermal transistor, Thin-Film Transistor, Transistor, transistors, zzsemiconducting materials

Category(s): Electrical, Electrical > Electronics & Semiconductors, Energy & Environment, Energy & Environment > Energy Generation, Energy & Environment > Energy Storage, Energy & Environment > Energy Transmission, Energy & Environment > Thermal, Electrical > Instrumentation, Materials, Materials > Nanotechnology

A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)

Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...

Published: 7/9/2024 | Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren

Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation