Search Results - electronics+packaging

3 Results

Sort By:

Intergrated Cavity Optomechanical Thermal Imaging Transducer (Case No. 2023-294)

Summary: UCLA researchers from the Department of Electrical and Computer Engineering have developed a novel transducer for integrated cavity optomechanical thermal imaging. Background: Measuring infrared (IR) radiation provides information across a range of scientific, industrial, and medical applications, and is widely used in thermography, medical...

Published: 7/3/2024 | Inventor(s): Chee Wei Wong, Jaime Flores, Talha Yerebakan

Keywords(s): cavity optomechanics, cryogenic cooling, Digital Electronics, Electronics & Semiconductors, electronics packaging, Environmental monitoring, infrared (IR) radiation, Integrated Cavity, Microelectronics, Nanoelectronics, non-invasive imaging, Optoelectronic materials, opto-electronic systems, Optoelectronics, Optoelectronics Waveguide (Electromagnetism), optofluidics, Optomechanical accelerometer, optomechanical oscillator, Optomechanical Thermal Imaging Transducer, photodetection, Power Electronics, radiation detection, spectral density, thermomechanical noise

Category(s): Electrical, Electrical > Imaging, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Thermoelectrics

A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)

Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...

Published: 7/9/2024 | Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren

Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation

2021-229 Processes, Equipment and Materials Recipes, and Related Know-How to Perform the Silicon-Interconnect Fabric (Si-IF) Chip-Scale Packaging Technology

Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a novel manufacturing process for Silicone-Interconnect Fabric (Si-IF) that is not only scalable, but also robust as it relies on established processing techniques from CMOS technologies. Background: With the rise of computation-heavy applications, such...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer

Keywords(s): Analogue Electronics, CMOS, Consumer Electronics, Digital Electronics, Electronic Packaging, Electronics & Semiconductors, electronics packaging, heterogenous electronic systems, Integrated Circuit Via (Electronics), Interposers, Nanotechnology, Power Electronics, Printed Circuit Board, Printed Electronics, Silicon

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Nanotechnology, Electrical > Electronics & Semiconductors > Memory