Search Results - materials+%3e+composite+materials

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Diamond Needle Insertion Technique for High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...

Published: 2/20/2026 | Inventor(s): Tiwei Wei

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)

Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors

Through-Glass Vias (TGVS) Thermal Management Using Diamond-Assisted Copper Metallization for Advanced 3DIC Packaging (Case No. 2026-156)

Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...

Published: 2/23/2026 | Inventor(s): Tiwei Wei, Ye Yang

Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials

Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking

Large-Area Solution-Processed Ionomer-Interlayered Bulk Monolayer MOS2 Membranes With Thickness-Scalable Bright Luminescence and Dual Electron-Ion Transport (Case No. 2025-281)

Summary: UCLA researchers have developed a novel hybrid 2D material platform that significantly improves the utility and optical performance of monolayer molybdenum disulfide (MoS2) by integrating a Nafion interlayer. Background: Monolayer transition metal dichalcogenides (TMDs), particularly MoS2, have shown promise in the fields of optics and...

Published: 9/25/2025 | Inventor(s): Xiangfeng Duan, Yu Huang, Boxuan Zhou

Keywords(s):

Category(s): Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Membranes, Materials > Composite Materials, Electrical, Electrical > Flexible Electronics, Electrical > Electronics & Semiconductors, Electrical > Sensors, Chemical, Chemical > Chemical Sensors, Chemical > Polymers

Mechanical Neural Network Driven by Flexure-Based, Meso-Scale, Bidirectional Thermal Actuators (Case No. 2024-235)

Summary: UCLA researchers in the Department of Mechanical Engineering have developed a novel bidirectional thermal linear transducer for active vibration dampening and high precision manufacturing equipment. Background: Metamaterials are engineered structures that demonstrate properties not commonly found in natural materials. To date, most...

Published: 7/2/2025 | Inventor(s): Jonathan Hopkins, Pietro Sainaghi, Michael Cullinan, Andrew Gray

Keywords(s):

Category(s): Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Construction Materials, Materials > Composite Materials, Mechanical, Mechanical > Aeronautics & Aerospace, Mechanical > Sensors, Mechanical > Micro-Electromechanical Systems (Mems), Mechanical > Mechanical Systems

Liquid Metal Printing Technique via Optical Maskless Lithography (Case No. 2024-031)

Summary: Researchers in the UCLA Department of Materials Science and Engineering have developed a facile, rapid method to print soft, wearable electronics. Background: Soft electrical circuits have garnered significant interest in a broad range of emerging technologies, including wearable electronics, brain-machine interfaces, and soft robotics....

Published: 3/6/2025 | Inventor(s): Ximin He, Dong Wu

Keywords(s): Coating, Coatings, Adhesives, & Inks, Electronics & Semiconductors, Fabrication Technologies, gallium-based liquid metals, General Device Coatings, Liquid metal particles, liquid metals, Metals, Microelectronics Semiconductor Device Fabrication, Polymer, Polymers, scalable fabrication, Semiconductor Device Fabrication, soft electrical circuits, soft electronics, wearable electronics, wearable sensors

Category(s): Chemical, Chemical > Polymers, Chemical > Coatings, Adhesives & Inks, Electrical, Electrical > Electronics & Semiconductors, Electrical > Sensors, Electrical > Instrumentation, Electrical > Flexible Electronics, Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Materials > Metals

Dynamic Extension of the Eyebox for Maxwellian View AR Waveguides (Case No. 2024-163)

Summary: Researchers in the Department of Electrical & Computer Engineering have developed a new metasurface material that improves the size and resolution of augmented reality overlays. Background: Augmented reality (AR) waveguide displays have revolutionized the way users can interact with virtual content overlaid in the real world. High...

Published: 2/14/2025 | Inventor(s): Chee Wei Wong, Hyunpil Boo

Keywords(s): artificial electromagnetic materials, artificial-intelligent materials, Augmented Reality, augmented reality (AR), bacterial nanocellulose, Carbon Nanotube, Composite Materials, Construction Materials, Extended reality, Functional Materials, intercalated materials, liquid crystal nanofibers, Materials, Medical Devices and Materials, meta materials, metal nanocomposites, metasurfaces, microarchitectured materials, Microfluidics Nanosphere, Mixed Reality, nanobody, nanocomposite scintillators, Nanocomposites, Nanocrystal, nanocrystalline metals, nanodispersion, Nanoelectronics, Nanoemulsion droplet, Nanofiber, nanograined metals, Nanomaterials, Nanoparticle, Nanoparticles, nanophotonic, nanophotonic structures, nanophotonics, Nanosensor, Nanostructure, nanostructured materials, Nanotechnology, Optoelectronic materials, photonic materials, Raw materials supplier, Toxicity Of Nanomaterials, Ultrahard materials/abrasives, Virtual Reality, Virtual Reality Braille Haptic Technology Joule Heating, Virtual Reality Occupational Therapy Exercise Machine, Water Purification, Nanofiltration, Ultrafiltration, zzsemiconducting materials

Category(s): Software & Algorithms, Software & Algorithms > Ar/Vr, Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Nanotechnology

Ion-Solvent-Polymer Interactions for Preparing Polymer Networks and Composites of Tunable Structures and Properties (UCLA Case No. 2023-147)

Summary: Researchers in UCLA's Department of Materials Science and Engineering have developed a solution-based synthesis platform capable of generating micro and nanostructured gels, polymers, and composites with simultaneously improved safety, mechanical and ionic conductivity/transport properties. Background: Pore structure engineering holds...

Published: 7/17/2025 | Inventor(s): Ximin He

Keywords(s):

Category(s): Chemical, Chemical > Polymers, Chemical > Synthesis, Energy & Environment, Energy & Environment > Energy Storage, Materials, Materials > Fabrication Technologies, Materials > Functional Materials, Materials > Composite Materials

2023-056 A Method to Make High Strength, High Ductility, and High Electrical Conductivity Metals

Summary: UCLA researchers in the Department of Materials Science and Engineering have developed ultra-strong metal nanocomposites with high ductility, thermal stability, and electrical conductivity. Background: In many different applications, including those in the aerospace, defense, electronics, energy, and transportation sectors, nanocrystalline...

Published: 2/14/2025 | Inventor(s): Yinmin Wang, Zan Li

Keywords(s): graphene, high-strength, metal nanocomposites, Metals, Nanocrystal, nanocrystalline metals, nanodispersion, nanograined metals, Nanomaterials, Nanoparticle, Nanoparticles, nanostructured materials, Nanotechnology, reduced graphene oxide, strength-ductility, strength-electrical conductivity, strength-thermal stability

Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Metals, Materials > Fabrication Technologies

2020-792 Hierarchical Porous Materials With Tunable Behavior Via Cononsolvency Effect

Summary: UCLA researchers in the Department of Materials Science and Engineering have developed a method of controlling the micro-porous structure of polymers and thus their diffusion and mechanical properties.Background: Hydrogels hold promise for various applications including solar vapor generation, drug delivery, and energy storage. These materials...

Published: 7/17/2025 | Inventor(s): Ximin He, Yousif Alsaid, Shuwang Wu

Keywords(s):

Category(s): Materials > Composite Materials, Materials > Nanotechnology, Materials > Functional Materials, Chemical > Polymers

2003-126 Glass-Modified Stress Waves for Adhesion Measurement of Ultra Thin Films and Nanoelectronics Device Fabrication

Professor Vijay Gupta - http://gupta.seas.ucla.edu/ SUMAMRY UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a fast, reliable, atomic-level sensitive adhesion metrology tool for measuring the tensile strength of multilayer interfaces and epoxy-bonded joints such as those appearing in the semiconductor (ICs,...

Published: 7/17/2025 | Inventor(s): Vijay Gupta, Vassili Kireev

Keywords(s):

Category(s): Electrical > Electronics & Semiconductors, Materials, Materials > Nanotechnology, Materials > Semiconducting Materials, Materials > Composite Materials, Materials > Fabrication Technologies

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