Search Results - electrical+breakdown

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Bringing Millimeter Wave Technology to Any IOT Device (Case No. 2023-280)

Summary: UCLA researchers in the Department of Computer Science have developed a novel method of enabling any existing Internet of Things (IoT) device to operate at higher frequencies of the wireless spectrum. Background: The growing presence of smart devices that can communicate, sense, and process data places demands on current wireless networks....

Published: 10/28/2024 | Inventor(s): Mohammad Hossein Mazaheri Kalahrody, Joerg Widmer, Domenico Giustiniano, Rafael Ruiz, Omid Abari

Keywords(s): BLE, Communication & Networking, Communications Satellite, device enhancement, downlink, Electrical, Electrical Brain Stimulation, Electrical Breakdown, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Load Equation Of State, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, electrically small antennas (ESAs), electrically-mediated sensing, energy efficient IoT, energy-efficient wireless communication, Internet of Things (IoT), IoT communication, IoT connectivity, LoRa, low-power device, Network Analysis (Electrical Circuits), operating range, Optical Communication , power conversion efficiency, quantum communication, RGID, scalable communication, smart connectivity, smart technology, strength-electrical conductivity, Telecommunication, Transcutaneous Electrical Nerve Stimulation, uplink, WiFi, wireless communication, wireless connectivity, wireless spectrum

Category(s): Electrical, Electrical > Wireless, Software & Algorithms, Software & Algorithms > Communication & Networking

Stain-Free, Rapid, and Quantitative Viral Plaque Assay Using Deep Learning and Holography (Case No. 2022-326)

Intro Sentence: UCLA researchers in the Department of Electrical and Computer Engineering have developed a rapid and stain-free quantitative assay using lens-free holography and deep learning to efficiently and cost-effectively determine the presence of viral plaque-forming units (PFUs) in samples. Background: A broad range of viruses have caused...

Published: 10/17/2024 | Inventor(s): Aydogan Ozcan, Yuzhu Li, Tairan Liu

Keywords(s): Antiviral Drug, Artifical Intelligence (Machine Learning, Data Mining), Assay, Bioassay, Computer Aided Learning, Diagnostic Markers & Platforms, Diagnostic Platform Technologies (E.G. Microfluidics), Diagnostic Test, Digital Holography, Electrical, Electrical Brain Stimulation, Electrical Breakdown, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Load Equation Of State, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Holography, Immunoassay, Immunoassay Sense (Molecular Biology), Lentivirus Viral Vector, Machine Learning, Machine Learning Autonomous Car Gradient Descent, Machine Learning Pain Management, Machine Learning Particulates Global Climate Model, Network Analysis (Electrical Circuits), Perceptual Learning, Plasmid Trabecular Meshwork Aqueous Humour Viral Vector, Targets And Assays, Transcutaneous Electrical Nerve Stimulation, Transfection Viral Vector, Unsupervised Learning , Viability Assay, Viral Delivery Systems, Viral Envelope, Viral Load

Category(s): Diagnostic Markers, Diagnostic Markers > Targets And Assays, Electrical, Life Science Research Tools, Life Science Research Tools > Research Methods, Life Science Research Tools > Other Reagents, Software & Algorithms > Artificial Intelligence & Machine Learning

Silicon Interconnect Fabric (Si-IF) Technologies - Subramanian Iyer

Background: Over the past two decades, silicon chips have decreased in size by 1000x, while packages on circuit boards have only shrunk by 4x. This will eventually limit scaling of integrated circuits and subsequent processor performance. A solution is the invention of platforms for packageless integration of heterogeneous dies, such as silicon interconnect...

Published: 7/19/2023 | Inventor(s): Subramanian Iyer

Keywords(s): Amorphous Silicon, Antenna (Radio) Flip Chip DisplayPort, Application-Specific Integrated Circuit, Bandwidth (Signal Processing), Bandwidth (Signal Processing) RF Transmitters, Brain-Computer Interface, Brain-Computer Interface Body Mass Index, Chipset, Computer Aided Design & Manufacturing, Computer Aided Learning, Computer Architecture, Computer Monitor, Computer Security, Computer Virus, Computer Vision, Computer-Aided Design, Computer-Aided Diagnosis, Continuum Mechanics Computer Graphics Collision Detection, Digital Signal Processing, Doping (Semiconductor), Electrical, Electrical Brain Stimulation, Electrical Breakdown, Electrical Engineering, Electrical Impedance, Electrical Load, Electrical Load Equation Of State, Electrical Resistance And Conductance, Electrical Resistivity And Conductivity, Electronics & Semiconductors, Enzyme Substrate (Biology), Graphics Processing Unit, Graphics Processing Unit Analog Computer, Human-Computer Interaction, Image Processing, Integrated Circuit, Integrated Circuit Standing Wave, Integrated Circuit Via (Electronics), Lab-On-A-Chip, Microelectronics Semiconductor Device Fabrication, Microprocessor, Mixed-Signal Integrated Circuit, Monolithic Microwave Integrated Circuit, Network Analysis (Electrical Circuits), Network On A Chip, Organic Semiconductor, Photonic Integrated Circuit, Printed Circuit Board, Process Optimization, Quantum Computer, Semiconductor, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, Short Circuit, Signal Processing, Silicon, Silicon Dioxide, Silicon Working Electrode Perovskite (Structure), Silicon-Germanium, Substrate (Chemistry), Supercomputer, System On A Chip, Tablet Computer, Three-Dimensional Integrated Circuit, Transcutaneous Electrical Nerve Stimulation, zzsemiconducting materials

Category(s): Electrical, Electrical > Electronics & Semiconductors, Materials, Materials > Semiconducting Materials, Medical Devices, Medical Devices > Coatings

2022-051 Reliable and Fault-Tolerant Clock Generation and Distribution for Chiplet-Based Waferscale Processors

Summary: UCLA researchers in the department of Electrical and Computer Engineering have developed an on-chip clock propagation circuit that allows creation of large-scale fault-robust processor systems which are essential for the next generation of big data solutions. Background: Waferscale processor systems can provide the large number of cores,...

Published: 12/12/2023 | Inventor(s): Puneet Gupta, Saptadeep Pal

Keywords(s): Chipset, Clock Signal, Computer Architecture, Electrical Breakdown, Electronics & Semiconductors, Integrated Circuit, Microprocessor, Network On A Chip, Semiconductor, Semiconductor Device, Semiconductors, Supercomputer, System On A Chip

Category(s): Electrical > Electronics & Semiconductors, Materials > Semiconducting Materials, Electrical, Electrical > Electronics & Semiconductors > Circuits