Search Results - materials+%3e+fabrication+technologies

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Mechanical Neural Network Driven by Flexure-Based, Meso-Scale, Bidirectional Thermal Actuators (Case No. 2024-235)

Summary: UCLA researchers in the Department of Mechanical Engineering have developed a novel bidirectional thermal linear transducer for active vibration dampening and high precision manufacturing equipment. Background: Metamaterials are engineered structures that demonstrate properties not commonly found in natural materials. To date, most...

Published: 5/14/2025 | Inventor(s): Jonathan Hopkins, Pietro Sainaghi, Michael Cullinan, Andrew Gray

Keywords(s):

Category(s): Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Construction Materials, Materials > Composite Materials, Mechanical, Mechanical > Aeronautics & Aerospace, Mechanical > Sensors, Mechanical > Micro-Electromechanical Systems (Mems), Mechanical > Mechanical Systems

Encapsulation of Fire-Resistant Materials in Adhesive Polymeric Carriers for Fire Prevention (Case No. 2025-240)

Summary: UCLA researchers from the Department of Chemistry and Biochemistry have developed a novel system for integrating fire-retardant compounds within an adhesive and sprayable material. Background: Fire management traditionally relies on the use of synthetic materials containing ammonium polyphosphate (APP), which are effective in fire suppression...

Published: 5/12/2025 | Inventor(s): Paul Weiss, Erika Lopez Lara

Keywords(s): antimicrobial materials, Composite Materials, Construction Materials, fire, fire resistant materials, fire resistant materials and nanotechnology, fire retardant, fire tech nanomaterials, Functional Materials, intercalated materials, Materials, Medical Devices and Materials, meta materials, microarchitectured materials, Nanomaterials, nanostructured materials, palisades, phase change materials, photothermal materials, safe materials, wildfire, wildfire prevention

Category(s): Materials, Materials > Fabrication Technologies, Materials > Functional Materials, Energy & Environment

Emissions-Free Olefin Synthesis via Concentrated Solar-Thermal Pyrolysis for Cleaner Plastics (Case No. 2025-008)

Summary: UCLA researchers in the department of mechanical and aerospace engineering have developed a novel technology that utilizes concentrated solar radiation to convert petroleum refinery hydrocarbons into light olefins with no CO2 emissions and generates a high-value graphitic carbon co-product. Title: Emissions-Free Olefin Synthesis via Concentrated...

Published: 5/6/2025 | Inventor(s): Anil Nair, Raymond Spearrin, Barathan Jeevaretanam

Keywords(s): bulk material, clean material production, Composite Material, Composite Materials, Concentrated Solar Power, Concentrated Solar Power Chemical Engineering, concentrated solar radiation, Construction Materials, emission free materials, ethylene, fire resistant materials, Functional Materials, graphitic carbon, HDPE, high density polyethylene, intercalated materials, LDPE, light olefin, low density polyethylene, material characterization, Material for Enhanced Photoprotection, material science, Materials, Medical Devices and Materials, Nanomaterials, olefin, olefin synthesis, plastic, plastic fabrication, plastic production, plastics, polypropylene, propylene, pyrolysis, Raw materials supplier, safe materials, Smart Material, zero emissions

Category(s): Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Energy & Environment

Liquid Metal Printing Technique via Optical Maskless Lithography (Case No. 2024-031)

Summary: Researchers in the UCLA Department of Materials Science and Engineering have developed a facile, rapid method to print soft, wearable electronics. Background: Soft electrical circuits have garnered significant interest in a broad range of emerging technologies, including wearable electronics, brain-machine interfaces, and soft robotics....

Published: 3/6/2025 | Inventor(s): Ximin He, Dong Wu

Keywords(s): Coating, Coatings, Adhesives, & Inks, Electronics & Semiconductors, Fabrication Technologies, gallium-based liquid metals, General Device Coatings, Liquid metal particles, liquid metals, Metals, Microelectronics Semiconductor Device Fabrication, Polymer, Polymers, scalable fabrication, Semiconductor Device Fabrication, soft electrical circuits, soft electronics, wearable electronics, wearable sensors

Category(s): Chemical, Chemical > Polymers, Chemical > Coatings, Adhesives & Inks, Electrical, Electrical > Electronics & Semiconductors, Electrical > Sensors, Electrical > Instrumentation, Electrical > Flexible Electronics, Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Materials > Metals

Nanotechnology-Enabled Reduction of Fusion-Induced Residual Stress in Alloys (Case No. 2024-225)

Summary: UCLA researchers in the Departments of Mechanical & Aerospace Engineering and Materials Science & Engineering have developed a novel method for stress reduction in welded alloy materials. Title: Nanotechnology-Enabled Reduction of Fusion-Induced Residual Stress in Alloys Background: Fusion welding is commonly used in manufacturing...

Published: 3/4/2025 | Inventor(s): Xiaochun Li, Nar Murali

Keywords(s): Alloy, metal nanocomposites, Metal process monitoring, Metalation, Metallurgy, Metals, nanocrystalline metals, nanograined metals

Category(s): Materials, Materials > Metals, Materials > Fabrication Technologies, Materials > Nanotechnology

A High Throughput Thermal Compression Bonding Scheme for Interposer and Wafer-Scale Advanced Packaging Constructs (Case No. 2023-144)

Summary: UCLA researchers in the Department of Electrical and Computer and Engineering have introduced a scalable and rapid bonding method for dielet assembly on advanced packaging constructs, achieving a remarkable throughput of over 1100 units-per-hour, or 10-fold higher than the conventional assembly method. Background: In semiconductor packaging,...

Published: 2/14/2025 | Inventor(s): Subramanian Iyer, Krutikesh Sahoo, Haoxiang Ren

Keywords(s): advanced packaging, advanced packaging constructs, dielet assembly, dielet bonding, Electronic Packaging, electronics packaging, Fabrication Technologies, face-to-face heterogeneous dielet bonding, heterogeneous integration, heterogenous electronic systems, high throughput, Instrumentation, Interposers, Microelectronics Semiconductor Device Fabrication, Organic Semiconductor, package scaling, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductors, thermal compression bonding, wafer-scale, wafer-scale computing, Waferscale Processors

Category(s): Electrical, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Waferscale Computing, Materials, Materials > Semiconducting Materials, Materials > Fabrication Technologies, Electrical > Instrumentation

Ion-Solvent-Polymer Interactions for Preparing Polymer Networks and Composites of Tunable Structures and Properties (UCLA Case No. 2023-147)

Summary: Researchers in UCLA's Department of Materials Science and Engineering have developed a solution-based synthesis platform capable of generating micro and nanostructured gels, polymers, and composites with simultaneously improved safety, mechanical and ionic conductivity/transport properties. Background: Pore structure engineering holds...

Published: 2/14/2025 | Inventor(s): Ximin He

Keywords(s):

Category(s): Chemical, Chemical > Polymers, Chemical > Synthesis, Energy & Environment, Energy & Environment > Energy Storage, Materials, Materials > Fabrication Technologies, Materials > Functional Materials, Materials > Composite Materials

2023-056 A Method to Make High Strength, High Ductility, and High Electrical Conductivity Metals

Summary: UCLA researchers in the Department of Materials Science and Engineering have developed ultra-strong metal nanocomposites with high ductility, thermal stability, and electrical conductivity. Background: In many different applications, including those in the aerospace, defense, electronics, energy, and transportation sectors, nanocrystalline...

Published: 2/14/2025 | Inventor(s): Yinmin Wang, Zan Li

Keywords(s): graphene, high-strength, metal nanocomposites, Metals, Nanocrystal, nanocrystalline metals, nanodispersion, nanograined metals, Nanomaterials, Nanoparticle, Nanoparticles, nanostructured materials, Nanotechnology, reduced graphene oxide, strength-ductility, strength-electrical conductivity, strength-thermal stability

Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Metals, Materials > Fabrication Technologies

2003-126 Glass-Modified Stress Waves for Adhesion Measurement of Ultra Thin Films and Nanoelectronics Device Fabrication

Professor Vijay Gupta - http://gupta.seas.ucla.edu/ SUMAMRY UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a fast, reliable, atomic-level sensitive adhesion metrology tool for measuring the tensile strength of multilayer interfaces and epoxy-bonded joints such as those appearing in the semiconductor (ICs,...

Published: 2/14/2025 | Inventor(s): Vijay Gupta, Vassili Kireev

Keywords(s):

Category(s): Electrical > Electronics & Semiconductors, Materials, Materials > Nanotechnology, Materials > Semiconducting Materials, Materials > Composite Materials, Materials > Fabrication Technologies

2020-456 Passive 3D Shape via Polarization-Aware Neural Networks

SUMMARYUCLA researchers in the Department of Electrical Engineering and Computer Science have developed an algorithm to take image data and generate accurate 3D shape representations using a deep neural network framework. The method uses data from polarization imaging to generate 3D models that are less sensitive to noise and that are five times more...

Published: 2/14/2025 | Inventor(s): Achuta Kadambi, Alex Gilbert, Franklin Wang, Yunhao Ba

Keywords(s):

Category(s): Software & Algorithms > Artificial Intelligence & Machine Learning, Materials > Fabrication Technologies, Mechanical > Robotics

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